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Advanced Electronics Packaging Digest

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MacDermid Alpha Showcases Advanced Soldering Materials for High-Reliability Electronics Assembly at NEPCON Thailand 2026

06/11/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will present its latest materials technologies at NEPCON Thailand 2026, held June 17 to 20 at the Bangkok International Trade & Exhibition Centre (BITEC), Thailand. Recognized as a premier gathering for technology leaders and manufacturers, the event supports one of the world’s most dynamic electronics manufacturing regions.

MacDermid Alpha Addresses Power Module Reliability Challenges at PCIM Europe 2026

06/01/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will exhibit at PCIM Europe 2026, June 9 - 11 in Nuremberg, Germany, Booth 7-460.

MacDermid Alpha Addresses Power Module Reliability Challenges at PCIM Europe 2026

06/01/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will exhibit at PCIM Europe 2026, June 9 - 11 in Nuremberg, Germany, Booth 7-460.

MacDermid Alpha to Address Silver Price Volatility Solutions at ECTC 2026

05/15/2026 | MacDermid Alpha
As volatile silver prices continue to place pressure on semiconductor packaging costs and supply chain predictability, MacDermid Alpha Electronics Solutions will highlight material strategies that help manufacturers reduce dependence on silver without sacrificing reliability, thermal performance, or manufacturing efficiency.

MacDermid Alpha to Debut Zero-PFAS Die Attach Paste ATROX CD 560-1 at SEMICON Southeast Asia 2026

04/27/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will debut ATROX® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON Southeast Asia 2026, May 5–7, in Kuala Lumpur, Booth 2423.
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