SEMICON Taiwan 2025 Set to Open, Spotlighting Global Collaboration

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SEMICON Taiwan 2025, the region’s most influential semiconductor event, opens this week. At today’s pre-show press conference, Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI; Dr. Tien Wu, Chair of the SEMI International Board Executive Committee and CEO of ASE; Doris Hsu, SEMI International Board of Director and Chairperson and CEO of GlobalWafers; Professor Tzi-Dar Chiueh, Dean of the College of Advanced Technology at National Taiwan University (NTU) and CEO of the Taiwan Chip-based Industrial Innovation Program Office; and Clark Tseng, Senior Director of Market Intelligence at SEMI, joined leaders from industry, government, and academia to share forward-looking perspectives on the semiconductor industry.

The focal point of International Semiconductor Week, this year’s SEMICON Taiwan adopts the theme Leading with Collaboration. Innovating with the World. The event features 25+ forums and 13 key technology themes, highlighting collaboration as the catalyst for the next wave of innovation. Industry leaders will share insights on AI-driven semiconductor trends, market strategies, and reveal key industry data.

AI Wave Drives Global Semiconductor Growth with Record Equipment Investments

According to SEMI’s latest Market Intelligence, AI is extending from the cloud to the edge and end devices, driving demand not only in data centers but also for local real-time computing. Capital expenditures by the top four cloud service providers are projected to grow from US$210 billion in 2024 to US$310 billion in 2025, fueling the demand for AI infrastructure. In 2025, AI and high-performance computing (HPC) related equipment investments are expected to account for 40% of global semiconductor equipment spending, and this share is anticipated to exceed 55% by 2030.

The global semiconductor equipment market is forecast to grow by 7.4% to $125.5 billion in 2025, with a further increase of 10% to reach a new high in 2026. Taiwan's investments are projected to reach $28 billion in 2025, an increase of over 70% year-on-year, driven by strong investments in HPC and advanced packaging. In terms of AI/HPC and memory transformation, GAA, HBM, 3D stacking, and chiplet packaging are becoming the focus of investment.

SEMI Leads New Model of Global Industry Collaboration with Standards and Alliances

Amid rising semiconductor investment, the industry is shifting from supply chains to ecosystem collaboration. “SEMI connects the entire value chain, from design and manufacturing to packaging and system applications, helping members seize emerging opportunities,” said Terry Tsao. “The theme of ‘Leading with Collaboration. Innovating with the World.’ captures this shift, as SEMICON has become the unique global platform uniting the full value chain, with SEMICON Taiwan bringing the top industry players from around the world together to advance technology.”

Building on this vision, SEMI has advanced key standards and alliances. After launching the Silicon Photonics Alliance (SiPhIA) in 2024 with TSMC, ASE, and over 100 companies, SEMICON Taiwan 2025 will introduce the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA). The event will also mark the launch of certification for SEMI E187, the world’s first semiconductor equipment cybersecurity standard initiated by Taiwan, reinforcing Taiwan’s role in shaping the global semiconductor ecosystem.

Tech Strength and Supply Chain Resilience Drive Confidence

Seizing vast AI opportunities, the semiconductor industry is demonstrating strong investment confidence. Dr. Tien Wu, Chair of the SEMI International Board Executive Committee and CEO of ASE, said: “The semiconductor industry is projected to surpass US$1 trillion in the next decade, reshaping the global value chain. Taiwan must leverage its leadership in advanced manufacturing processes for AI and data center applications, as well as capitalize on the region's robust semiconductor ecosystem to strengthen its competitiveness through effective communication and a strategic focus on collaboration,”.

Doris Hsu, SEMI International Board of Directors and Chairperson and CEO of GlobalWafers, said, "AI is driving the strongest growth in both demand and pricing, and Taiwan’s complete ecosystem enables the industry to respond quickly to global needs while serving as a vital hub for supply chain collaboration."

Chip-based Industrial Innovation Program Boosts Industry Alignment and Talent Growth

To reinforce industry investment, the government has introduced forward-looking policies through the Taiwan Chip-based Industrial Innovation Program. Professor Tzi-Dar Chiueh, Dean of the College of Advanced Technology at NTU and CEO of the Taiwan Chip-based Industrial Innovation Program Office, said: “Amid intense global competition, supply chain shifts, and rising innovation demands, the program is enabling Taiwan’s transition from manufacturing to innovation leadership and positioning the economy as a driving force in global semiconductor development.”

In response to the talent shortage, industry and academia are joining forces to cultivate the next generation, with early outcomes already visible. This year, the SEMI Taiwan 20 Under 40 Award honored 24 outstanding professionals under 40, reflecting progress in developing a strong talent pipeline. As part of the selection committee, Professor Chiueh noted that aligning policy direction with industry investment needs will provide a solid foundation for strengthening competitiveness in the AI era.

Startup Zone Debuts, Driving Innovation and Ecosystem Collaboration


SEMICON Taiwan 2025 will feature over 200 global speakers, with forums covering heterogeneous integration, leadership insights from top CEOs, and the Memory Executive Summit bringing SK hynix, Samsung, and Micron together for the first time. A major highlight is the debut of the Silicon Startups Zone, co-organized with the IC Taiwan Grand Challenge (ICTGC), showcasing next-generation technologies such as 5G/6G, post-quantum cryptography, AI silicon photonics, SiC power devices, Wi-Fi 7 RF integration, and wireless charging. The zone will connect Taiwan’s complete supply chain to drive global investment, collaboration, and market growth, embodying the event theme: Leading with Collaboration. Innovating with the World.

“With its complete ecosystem spanning equipment, manufacturing, and applications, Taiwan is indispensable in the global supply chain,” said Tsao. “As AI reshapes the industry, Taiwan’s US$27.9 billion investment in semiconductor equipment underscores its central role, with SEMICON Taiwan serving as a vital platform for global collaboration and innovation.”