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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Elektrobit, Microchip Partner on AUTOSAR Automotive Solutions

10/19/2026 | Microchip
Elektrobit, a global expert in automotive software, and Microchip Technology Inc., a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a collaboration to simplify and accelerate AUTOSAR-based software development for automotive manufacturers and suppliers using Microchip automotive platforms.

Polar, IC-Link by imec Partner on 8-Inch GaN Manufacturing

10/19/2026 | Polar Semiconductor, LLC
Polar Semiconductor, LLC (Polar), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, and IC-Link by imec, imec’s design and manufacturing service, announced they are collaborating to provide 8-inch production of enhancement-mode (e-mode) GaN devices to serve critical markets such as AI data centers, automotive, aerospace & defense, and the industrial grid.

Foxconn, Mitsubishi Electric Finalize Automotive Equipment Alliance

10/16/2026 | Foxconn
Through the alliance, the companies aim to develop next-generation mobility and thereby strengthen the sustainable growth of the Japanese automotive industry.

EDA Market to Reach $34.5B by 2033 on AI and Cloud Growth

10/15/2026 | Globe Newswire
The global Electronic Design Automation (EDA) market is positioned for substantial growth as semiconductor manufacturers and electronics companies address increasingly complex product designs.

October SMT007 Magazine Examines Automotive Soldering Reliability

10/01/2026 | I-Connect007 Editorial Team
The October 2026 issue of SMT007 Magazine is now available. As automakers add more electronics while maintaining high production volumes, the stakes for reliable electronics assembly continue to rise. Every added board, sensor, and control system must perform consistently under demanding conditions.
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