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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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10/16/2026 | Michelle Te, I-Connect007
Working from home really has its perks, especially when it comes to driving. I don’t miss the commute time, driving in the rain, or having to maneuver around everyone else going to work or coming home. Simply popping up to my desk in the morning is such a benefit. But what I do miss is being physically with my coworkers and the interactions that can happen when you’re all together. You just don’t get the synergy over a Teams call that you can get in person. Even more, being together fosters a sense of camaraderie you can’t get any other way.

Kratos Breaks Ground on New AN/SPY-1 Radar and Helios Hypersonics Testing Facilities in Indiana

10/15/2026 | Globe Newswire
Kratos Defense & Security Solutions, Inc., a technology company in defense, national security, and global markets, today celebrated a joint groundbreaking ceremony, at the Westgate Academy in Odon, Indiana, marking the beginning of construction for its new Helios and AN/SPY-1 facilities.

Rehm Thermal Systems Strengthens Its Presence in Spain and Portugal: Propelec Appointed as New Representative

10/14/2026 | Rehm Thermal Systems
Rehm Thermal Systems is expanding its sales activities in the Spanish and Portuguese markets and has appointed Propelec S.L. as its new representative for the Protecto and RDS UV LED product ranges.

Scale-Up: From Monolithic Silicon to Advanced Packaging

10/15/2026 | Chetan Arvind Patil, Marvell Technology
This is the first in a three-part series exploring scale-up, scale-out, and scale-across in advanced packaging. Scale-up focuses on increasing compute capability, memory capacity, and communication bandwidth within tightly integrated computing systems. Scale-out expands computing capacity by connecting multiple servers, compute nodes, and racks through high-speed networks. Scale-across focuses on integrating and coordinating diverse computing resources, technologies, and workloads across data centers to improve overall efficiency and resource utilization.

Foxconn Research Institute’s Two Quantum Studies Accepted by FOCS 2026

10/13/2026 | Foxconn
Demonstrating its strong forward-looking R&D capabilities, two fundamental theoretical studies from the Hon Hai Research Institute, under Hon Hai Technology Group (Foxconn), have been accepted by the IEEE Symposium on Foundations of Computer Science (FOCS 2026), universally recognized as the highest distinction in theoretical computer science.
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