U.S. CHIPS Act Funding Detailed on SIA Website
September 12, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA). The SIA “CHIPS R&D Programs” website shows how these programs stack up against the other programs and against the program as a whole.
Together, the NAPMP and MFG USA programs manage just over $2 billion of the $13 billion total CHIPS funding. The SIA report provides a map of the U.S, marking where these programs are located, as well as a comprehensive list of every CHIPS Act program currently funded. NAPMP comprises four separate projects, while the MFG USA program administers a single project.
Within MFG USA, the funding launches a new institute, known as SMART USA (Semiconductor Manufacturing and Advanced Research with Twins USA), which will, according to the press release, “focus on efforts to develop, validate, and use digital twins to improve domestic semiconductor design, manufacturing, advanced packaging, assembly, and test processes. SMART USA will join an existing network of seventeen institutes designed to increase U.S. manufacturing competitiveness and promote a robust R&D infrastructure.”
Among the funded NAPMP programs is an advanced packaging research facility to be launched at Arizona State University, Applied Materials for silicon-core substrate technology, a project at Absolics to develop a glass-core packaging ecosystem” for glass substrates, and a second project at Arizona State University to develop “the next generation of microelectronics packaging through fan-out-wafer-level-processing (FOWLP).”
Resources:
- Semiconductor Industry Association “CHIPS R&D Programs.”
- “CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins,” commerce.gov, Nov. 19, 2024.
- “Third CHIPS for America R&D Flagship Facility Announced,” Natcast.org, Jan. 6, 2025.
- “CHIPS for America: Applied Materials,” NIST.gov.
- “CHIPS for America: Absolics Inc.,” NIST.gov.
- “Chips for America: Arizona State University,” NIST.gov.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Technica Hosts In-House Visit from PCBAA
10/01/2025 | Technica USADavid Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A.
Pusan National University Scientists Develop Self-Deploying Material for Next-Gen Robotics
09/02/2025 | PRNewswireThe field of robotics has transformed drastically in this century, with a special focus on soft robotics. In this context, origami-inspired deployable structures with compact storage and efficient deployment features have gained prominence in aerospace, architecture, and medical fields.
Technica Demo Days Event Proves to Be Beneficial to Customers
08/18/2025 | Technica USATechnica USA’s Demo Days Event, took place August 13–14 at the company’s Demo Center in San Jose, California. The event featured live demonstrations and presentations from key supply partners ESSEMTEC, INOVAXE, and PARMI showcasing the latest innovations in SMT manufacturing and automation technology.
Technica to Host Demo Days Event August 13-14
08/04/2025 | Technica USATechnica USA is proud to announce its upcoming Demo Days Event, taking place August 13–14 at the company’s Demo Center in San Jose, California. The event will feature live demonstrations and presentations from key supply partners ESSEMTEC, INOVAXE, and PARMI showcasing the latest innovations in SMT manufacturing and automation technology.