Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Neways Appoints Gerben Edelijn as Member of its Supervisory Board

09/25/2026 | Neways
Neways Electronics International N.V. announces the appointment of Mr Gerben Edelijn as a member of its Supervisory Board effective 22 September 2026.

ESGS 2026 to Drive Innovation Across the Electronic Gases Ecosystem

09/25/2026 | SEMI
The Electronic Specialty Gases & Systems Conference (ESGS) 2026 will bring together leaders across the electronic gases value chain November 10-12, 2026, at the Hyatt Regency Phoenix in Arizona.

Teledyne Energy Systems Selected by NASA for Collaboration to Advance Lunar Power Technology

09/25/2026 | BUSINESS WIRE
Teledyne Energy Systems, Inc., a subsidiary of Teledyne Technologies Incorporated, has been selected to participate in NASA’s Announcement of Collaboration Opportunity, establishing a collaborative effort with NASA’s Glenn Research Center and Johnson Space Center to advance next-generation space power technology.

Keysight Enables UC Berkeley Research to Advance 6G Over-the-Air Testing

09/25/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced a new collaboration supporting research at the Berkeley Wireless Research Center (BWRC) that aims to accelerate and improve testing of next-generation wireless devices.

Latest Episode of Qnity Podcast Series Explores Materials for Mission-Critical Reliability

09/25/2026 | I-Connect007
The second episode of Engineering What’s Next, a podcast series from Qnity, is now available on I-Connect007. The series explores the materials, technologies, and expertise shaping the next generation of electronics. In “Materials for Mission-Critical Reliability,” host Marcy LaRont speaks with Rich Wessel, Industrial Application Leader, Laminates, about the increasingly complex demands placed on materials as electronics move into more challenging and mission-critical applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in