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Knocking Down the Bone Pile: Precision Milling of Underfilled Surface-mount Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 

Incap Group Reports Q1 2026 Revenue Growth and Completion of Lacon Acquisition

05/06/2026 | Incap
Incap estimates that the company’s revenue and comparable EBITA in 2026 will be clearly higher than in 2025. The estimates include the impact of Lacon’s acquisition and are given provided that unexpected events impacting Incap’s business environment do not occur.

Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish

05/07/2026 | Matt Stevenson -- Column: Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.

Electronics Manufacturing Needs Your Voice: Global Sentiment Survey Now Live

04/30/2026 | Global Electronics Association
The latest monthly Global Sentiment Survey from the Global Electronics Association is now open. At a time when demand uncertainty, policy shifts, energy costs, and supply chain recalibration are pulling the industry in multiple directions, the survey captures something macroeconomic data often misses: how manufacturers are actually experiencing conditions on the ground.

Strong AI Demand vs. Weak Consumer Segment Creates Pricing Divergence Among MLCC Suppliers

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TrendForce’s latest research shows that the MLCC market in 2Q26 is showing a clear split between robust AI-driven demand and soft consumer demand.
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