Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing
October 10, 2025 | SEMIEstimated reading time: 2 minutes

SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Erich Thallner, President and Co-founder of EV Group (EVG), as its first SEMI Americas Catalyst Award recipient at SEMICON West 2025. This new award will be presented annually to individuals and organizations whose visionary leadership, technical excellence, and collaborative nature have uplifted the semiconductor industry.
Since founding EVG in 1980, Thallner has been instrumental in perfecting the company’s tight product development process, resulting in numerous innovations that have transformed the global industry. His consistent and strategic R&D investments have also positioned the company to quickly transition products from development and small-scale manufacturing to high-volume production.
“Several important technologies would not have been realized without Erich's forward-thinking leadership,” said Joe Stockunas, President of SEMI Americas. “In an industry that constantly requires new innovations to keep up with rising chip demand, Erich’s commitment and ability to spot trends early have been fundamental for industry-wide advancement. SEMI is proud to honor Erich as our first SEMI Americas Catalyst Award recipient – his 45 years of dedicated industry service have set the bar high.”
Thallner Thallner has led EVG to multiple groundbreaking and original discoveries, including the first double-sided mask aligner for MEMS commercialization, the first temporary bonding and debonding solution, and the first automated wafer bonding system for 300-mm wafers, among several others.
Additionally, Thallner played a pivotal role in establishing EVG’s presence in the United States. Headquartered in St. Florian am Inn, Austria, the company brought its sales, technical equipment support, and process services to Arizona in 1994, decades before most others would follow suit. EVG has since expanded its North American presence to both Oregon and New Mexico and aligned with Arizona State University to support its Flexible Electronics and Display Center (FEDC).
“I am deeply honored to accept the SEMI Americas Catalyst Award,” said Erich Thallner. “As a long-standing SEMI member, EVG shares the goals of this leading industry association to help the semiconductor supply chain members grow their business and address top challenges worldwide. In line with our Triple-i philosophy of ‘invent - innovate – implement’, we enable our customers, including our strategic partners in North America, to successfully realize their product ideas. Our North America subsidiary has played a pivotal role in this effort for more than 30 years.”
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.