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Indium Experts to Deliver Technical Presentations at SMTA International
October 14, 2025 | Indium CorporationEstimated reading time: 1 minute
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
October 20
4:30 p.m.
A Bi-Free In-Containing Lower Temperature Solder with Superior Drop Shock Resistance and Electromigration Resistance, presented by Associate Scientist Mengyao Wen, authored by Dr. Hongwen Zhang, Danyang Zeng, and Huaguang Wang
October 21
9:00 a.m.
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly With Lower Temperature Soldering Phase I: Processing Optimization, presented by Associate Scientist Cassandra Goppert, authored by Dr. Hongwen Zhang, Dr. Francis Mutuku, and Huaguang Wang
11:00 a.m.
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly With Lower Temperature Soldering Phase II: TCT Reliability, presented by R&D Manager, Alloy Group, Principal Metallurgist Dr. Hongwen Zhang, co-authored by Danyang Zeng, Huaguang Wang, and Dr. Francis Mutuku
2:00 p.m.
Effect of Copper Content on Interfacial Reaction of In-Containing Lead-Free Solder Joints Across Different Surface Finishes, presented by Research Metallurgist Huaguang Wang
4:30 p.m.
Supercooled Solder Pastes for Low-Temperature Electronics Manufacturing, presented by Associate Scientist I Radhika Jadhav, co-authored by Dr. Yifan Wu and Dr. Ian Tevis
October 22
2:00 p.m.
A Novel Flux-Less Solder Paste Reflowed Under Formic Acid for Surface Mounting Technology, presented by R&D Assistant Manager Lily Bai
2:30 p.m.
Application of New Ultra-Low Residue Solder Paste for System-in-Package, presented by Senior Area Technical Manager, East China, Leo Hu Yan Jie, co-authored by Jonas Sigfrid Sjoberg, Xinfang Liu, Jinjin Bai, and Fiona Chen
3:00 p.m.
Influence of Reflow Temperature on the Mechanical Strength of Lower-Temperature Solder Pastes Across Various Surface Finishes, presented by Research Chemist-Metallurgist Dangyang Zheng, co-authored by Liam Evans, Cassandra Goppert, Mengyao Wen, Dr. Huaguang Wang, Dr. Francis Mutuku, and Dr. Hongwen Zhang
5:30 p.m.
Void Mitigation for Exposed Pad of D2PAK Component, presented by Associate Director for Global Technical Services and Application Engineering Jonas Sjoberg, authored by Tushar Tike
6:00 p.m.
Optimizing Mixed Alloy Solder Pastes for Low Voiding and High PCB Reliability, presented by Technical Support Engineer II Thuy Nguyen, co-authored by Dr. Hongwen Zhang, Dr. Ronald C. Lasky, and Adam Murling
October 23
9:00 a.m.
Tin Whiskers 101: 2025, presented by Senior Technologist Dr. Ron Lasky
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