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WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
October 29, 2025 | WestDev Ltd.Estimated reading time: 1 minute
Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software. This integration provides PCB designers with an efficient, data-consistent workflow for advanced thermal simulation and verification.
As electronic systems become smaller and more powerful, managing heat flow is critical to ensuring performance and reliability. The new Pulsonix-TRM interface bridges the gap between PCB layout and thermal analysis, enabling engineers to identify and address potential thermal issues earlier in the design process.
Streamlined Data Exchange
The Pulsonix-TRM interface allows design data to be exported directly in a TRM-compatible format, maintaining layer stack information, copper areas, vias, and component power data with full accuracy. This eliminates the need for manual data translation, reducing setup time and the risk of errors. Designers can run TRM simulation analysis, and feed results back into the PCB layout for immediate evaluation using their original PCB design.
Powerful Thermal Insight
TRM provides advanced modelling of heat conduction through multilayer PCBs, including copper planes, vias, and heat-dissipating components. Using accurate material properties and board geometries, it calculates temperature distributions, thermal resistances, and hotspot locations-helping designers optimise copper areas, cooling paths, and component placement.
Benefits for Design Teams
Integrated workflow: Smooth transition between Pulsonix PCB design and TRM thermal analysis.
- Data integrity: No intermediate file editing or geometry loss.
- Early design validation: Thermal risks identified and resolved before prototype stage.
- Improved reliability: Better prediction of heat flow and temperature gradients.
“Thermal behaviour has become a key constraint in modern electronics,” said Bob Williams, Marketing Director at WestDev Ltd. “By linking Pulsonix directly with TRM, we're giving designers immediate access to accurate thermal insight-without leaving their familiar environment.”
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Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.
Rubin’s Cableless Architecture and ASIC High-Layer HDI Designs Push PCBs to the Center of AI Compute Power
11/20/2025 | TrendForceTrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance.