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GEN3 Systems to Showcase Advanced Reliability Test Solutions at productronica 2025 in Munich

10/29/2025 | Gen3 Systems
GEN3 a leader in innovative reliability test solutions, is excited to announce its participation at productronica 2025, the world’s premier trade fair for electronics development and production.

Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics

10/28/2025 | John Watson -- Column: Elementary, Mr. Watson
If electricity were a group of college students, then power electronics and the PCB designers who dive into it would insist on driving the car on every road trip because they know the car inside and out—they’re the students with jumper cables in the trunk, a tire pressure gauge in the glove box, and snacks stashed under the seat. While the others argue over playlists and directions, power electronics is busy ensuring the alternator doesn’t fry, the headlights don’t dim, and everyone reaches the destination with fuel still in the tank.

Small Material, Big Impact: IDTechEx Explores Graphene in Electronic Applications

10/27/2025 | IDTechEx
Graphene was initially celebrated as a sci-fi material destined to transform electronics, quantum devices, and futuristic sensors. While expectations soared, commercial reality proved more modest.

Peters Spotlights Heatsink Paste at productronica

10/22/2025 | Peters
The ELPEPCB HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.

Indium Expert to Present on Advancing Thermal Performance at TestConX China

10/21/2025 | Indium Corporation
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
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