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Sealed for Survival: Potting Electronics for the Toughest Environments
October 29, 2025 | Beth Massey, MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
Electronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
As devices become increasingly smaller, smarter, and more connected, safeguarding them has become more complex. This article examines the challenges of protecting modern electronics, with a particular focus on wireless sensor applications where reliable RF signal transmission and moisture resistance are critical. It compares key performance characteristics of epoxy-, polyurethane-, and silicone-based potting materials, discusses material selection criteria, and highlights the need for innovative formulations. Real-world case studies, such as tire pressure monitoring systems (TPMS) and water monitoring sensors, demonstrate how these materials directly influence device performance and long-term reliability.
Why Potting Matters
Moisture and contaminants in the operating environment pose a serious threat to the performance and longevity of electronic devices. Even small amounts of water vapor or condensation can lead to short circuits, corrosion, component degradation, and permanent damage. Environmental pollutants, such as sulfur compounds, acids, and fine particulates, when combined with moisture, rapidly accelerate corrosion and damage. Devices operating in these types of harsh environments, such as tire pressure monitoring systems (TPMS) and remote water monitoring sensors, are especially vulnerable. In such cases, mechanical enclosures alone provide insufficient protection.
To continue reading this article, which originally appeared in the October 2025 edition of the Design007 Magazine, click here.
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