Hofstetter PCB Group Purchases Mass-PCB Vacuum-Filling & Planarising System from Adeon Technologies for New Via Filing Subcontract Services

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During the Productronica Exhibition in Munich from November 18 through to 21, Adeon is announcing the sale of the newest 2025 model Via Filling equipment with Large Container System and the Planarising system from Mass-PCB to SMF-Hofstetter from Herrenberg, Germany.

The complete line will be exhibited on the Adeon booth to be installed at SMF Hofstetter after the Productronica. The decision towards the Mass equipment from SMF Hofstetter was made after through evaluation at the Mass-PCB Demo Application Centre in Anröchte, Germany.

The new development from Mass-PCB is the resulting combination of 20 years’ experience in this field and converting a scientific research project lead by the Mass-PCB management together with the experiences from Adeon coming from the field. It encompasses higher reliability and uniformity at lowest vacuum rates possible, which can be held at process times suitable for all types of design complexity.

This is also another important step for the Hofstetter PCB Group in expanding its range of services and capabilities for the European printed circuit board industry. Printed circuit board manufacturers now have the option of sending their panels for the plugging process directly to the same address as the products for plating Jobs and having them returned together with the plated panels.

SMF-Hofstetter has chosen Lackwerke Peters as their supplier of Resin Filling Paste. Lackwerke Peters has actively supported the trials and evaluation with their latest development of Resin Paste.

SMF-Hofstetter, Mass-PCB and Adeon, will jointly support this important landmark, showing confidence and strength to the European PCB industry.

Adeon, as the distributor and service partner for Mass-PCB since 2004, is extremely proud to have such a competent company like SMF Hofstetter as partner. We welcome all Poductronica visitors to our booth in Hall B3 to meet the teams behind this and see the equipment.

The process will be available to all PCB manufacturers at SMF Hofstetter in Herrenberg from January 2026. Preliminary clarifications can be made in advance.