-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
October 31, 2025 |Estimated reading time: 1 minute
Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
Shipment Overview
The latest shipment includes a suite of high-performance plasma systems and intelligent automation solutions designed for printed circuit board (PCB) and semiconductor manufacturing. Each system is engineered to meet the rigorous demands of modern production environments and is recognized for its precision, efficiency, and adaptability.
Key Equipment Highlights
Plasma Etching & Cleaning Systems
- Automated lift-gate interface for seamless integration
- High etch rate with >85% uniformity in photoresist removal
- Capable of processing high aspect ratio materials (up to 50:1)
Automation Equipment
- Dual/multi-chamber configurations compatible with manual and AGV loading
- Barcode-driven auto-adjustment for fixture sizing
- Adaptive operation modes for thin and thick substrates
Commitment to Manufacturing Excellence
With coordinated output from its headquarters and second manufacturing facility, Henger Microelectronics continues to deliver high-quality plasma solutions backed by years of research, development, and engineering innovation. The company’s dedication to excellence and product reliability has earned broad recognition in international markets.
Driving Global Growth
This shipment represents a key milestone in Henger’s globalization roadmap, showcasing its ability to meet international demand with scalable, high-performance plasma technologies. Moving forward, the company plans to increase R&D investment, enhance product performance, and continue expanding its footprint across the global PCB and semiconductor sectors.
“This successful delivery to Southeast Asia reflects our unwavering commitment to innovation and global collaboration,” said a spokesperson for Henger Microelectronics. “We remain dedicated to supporting advanced manufacturing worldwide through reliable, cutting-edge plasma technologies.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Standard of Excellence: Speed vs. Quality in Customer Service
10/29/2025 | Anaya Vardya -- Column: Standard of ExcellenceThe key to a company’s success is excellent customer service. In our industry, with tight deadlines, high expectations, and particularly where customers demand immediate responses, there’s a challenging balancing act between speed and quality. PCB companies—like all businesses serving demanding B2B clients in aerospace, defense, medical, and high-reliability markets—often feel caught between responding quickly and providing accurate, helpful, and meaningful information.
TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
10/27/2025 | I-Connect007 Editorial TeamTSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.
American Standard Circuits Launches 50th 77-Second Webinar
10/27/2025 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits/ASC Sunstone Circuits is pleased to announce that they have recently unveiled their 50th 77-second webinar.
Sensors: The Invisible Force Behind Modern Convenience and Safety
10/24/2025 | Sanjeev Mane, Brooks AutomationSensors and sensor technology are fundamental components of modern life that drive innovation across various electronics and devices. From smartphones to industrial machinery, these small but powerful tools enable seamless interaction with the environment, ensuring efficiency and safety. This article serves as an introduction and overview of sensor technology, highlighting its significance in modern applications and its growing importance in the market as we embrace smarter, more connected systems.