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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
November 3, 2025 | Globe NewswireEstimated reading time: 1 minute
TTM Technologies, Inc., a leading global manufacturer of technology products, including mission systems, radio frequency (RF) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (PCBs), proudly announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
The honorees include Meising Ho, Vice President of Commercial Technology at TTM, who received the IPC ASSC (Asian Standards Steering Committee) Outstanding Service Award, and Richard Xie, Vice President of Human Resources, Asia Pacific at TTM, who was awarded the IPC AESC (Asian Education Steering Committee) Outstanding Service Award. These distinguished awards honor significant contributions to advancing industry standards and education in the electronics manufacturing sector across Asia.
"We are incredibly proud of Meising and Richard for this well-deserved recognition," said Doug Soder, Executive Vice President and President Commercial Sector of TTM. "Their dedication and contribution exemplify TTM's commitment to leadership and excellence in the electronics industry. These honors reflect not only their individual achievements but also TTM's ongoing commitment to shaping the future of the electronics industry."
The IPC CEMAC (China Electronics Manufacturing Annual Conference) is an annual gathering of electronic industry professionals from around the world for knowledge-sharing, experience exchange, and discussions on industry trends.
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Julia McCaffrey - NCAB GroupSuggested Items
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors
05/13/2026 | Michigan Tech Electronics HubThe energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.
Federal Electronics’ Hermosillo Facility Now CSA-Certified for Wire Harness Assemblies
05/13/2026 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, announced that its Hermosillo, Mexico facility has been approved to apply the CSA mark to wire harness assemblies.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.