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TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
November 3, 2025 | Globe NewswireEstimated reading time: 1 minute
TTM Technologies, Inc., a leading global manufacturer of technology products, including mission systems, radio frequency (RF) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (PCBs), proudly announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
The honorees include Meising Ho, Vice President of Commercial Technology at TTM, who received the IPC ASSC (Asian Standards Steering Committee) Outstanding Service Award, and Richard Xie, Vice President of Human Resources, Asia Pacific at TTM, who was awarded the IPC AESC (Asian Education Steering Committee) Outstanding Service Award. These distinguished awards honor significant contributions to advancing industry standards and education in the electronics manufacturing sector across Asia.
"We are incredibly proud of Meising and Richard for this well-deserved recognition," said Doug Soder, Executive Vice President and President Commercial Sector of TTM. "Their dedication and contribution exemplify TTM's commitment to leadership and excellence in the electronics industry. These honors reflect not only their individual achievements but also TTM's ongoing commitment to shaping the future of the electronics industry."
The IPC CEMAC (China Electronics Manufacturing Annual Conference) is an annual gathering of electronic industry professionals from around the world for knowledge-sharing, experience exchange, and discussions on industry trends.
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Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.