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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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MacDermid Alpha Launches ATROX® CD 560-1: Zero PFAS Alternate Silver Filler Die Attach Paste

06/18/2026 | MacDermid Alpha Electronics Solutions
With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX® CD 560-1, a zero per- and polyfluoroalkyl substances (PFAS) alternate silver filler die attach paste designed for metal leadframe packages and high-speed automated dispensing in modern manufacturing environments.

Coherent Secures $50M CHIPS LOI to Expand AI Infrastructure Manufacturing

06/18/2026 | Coherent
Coherent Corp., the global photonics leader, today announced it has signed a letter of intent to receive up to $50 million in direct funding under the CHIPS and Science Act from the U.S. Department of Commerce to expand its world-leading 6-inch Indium Phosphide (InP) semiconductor manufacturing facility in Sherman, Texas.

SIA Applauds CHIPS Act Incentives for Coherent

06/18/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding manufacturing incentives announced by the Commerce Department and Coherent to support the expansion of Coherent’s indium phosphide manufacturing facility in Sherman, Texas.

TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the US

06/16/2026 | BUSINESS WIRE
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.

Semiconductor Leaders Mark 30th Anniversary of Global Industry Cooperation in Geneva

06/16/2026 | ESIA
On June 11, 2026, the world's leading semiconductor industry associations concluded the 30th anniversary meeting of the World Semiconductor Council (WSC), held June 8-12 in Geneva, Switzerland, and hosted by the European Semiconductor Industry Association (ESIA).
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