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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/07/2025 | Marcy LaRont, I-Connect007
In electronics industry news, my picks start with Pete Starkey’s review of EIPC’s latest Technology Snapshot webinar. With all eyes on Europe as a pressure lever for ESG worldwide, Pete’s coverage is a must-read. Next, I want you to check out the new column by Leo Lambert on EPTAC, who provides a solid and complete overview of UHDI from concept to assembly. 

Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging

04/30/2025 | Real Time with...IPC APEX EXPO
In a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.

Marcy’s Musings: Can You Hear the Voices?

04/16/2025 | Marcy LaRont -- Column: Marcy's Musings
Tariffs, CapEx spending, the war in Ukraine, and domestic and global economies: I wanted to know what’s on your minds as we launch headlong into Q2 2025. So, this month, I’m highlighting industry voices and how they feel about their businesses, the effects of a new U.S. administration, and where technology is heading.

Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations

04/09/2025 | Real Time with...IPC APEX EXPO
Mark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.

Imagine the Possibilities: Tech Conference 2025

03/05/2025 | Marcy LaRont, I-Connect007
As we approach the 25th anniversary of IPC APEX EXPO, excitement buzzes around the annual Technical Program. Coming off a tremendously successful program in 2024—co-hosted with ECWC16 and with a significant global presence—organizers wanted to match that same level of engagement. In this interview, Stan Rak of SF Rak Company and Udo Welzel of Robert Bosch Mobility Electronics, co-chairs of the Technical Program Committee (TPC), highlight efforts of the volunteer committee to bring another quality technical program to life.
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