-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
CSP CapEx Expected to Exceed US$600 Billion in 2026, Ushering in a New Growth Cycle for the AI Hardware Ecosystem
November 6, 2025 | TrendForceEstimated reading time: 1 minute
As major North American CSPs release their latest earnings and investment outlooks, TrendForce has increased its 2025 CapEx forecast for the top eight CSPs worldwide from 61% YoY growth to 65%. For 2026, CSPs are anticipated to continue investing aggressively, with total CapEx expected to exceed US$600 billion, marking a 40% YoY increase. This trend highlights the strong long-term growth potential of AI infrastructure.
The eight CSPs include Google, AWS, Meta, Microsoft, and Oracle in the U.S., as well as Tencent, Alibaba, and Baidu in China.
- Google has increased its 2025 CapEx projection to $91–93 billion to accommodate the growing demand for AI data centers and cloud services.
- Meta raised its 2025 CapEx forecast to $70–72 billion, highlighting a substantial rise in spending expected again in 2026.
- Amazon lifted its 2025 CapEx forecast to $125 billion.
- Microsoft did not disclose full-year figures, but CapEx for 2026 is anticipated to surpass that of 2025.
TrendForce indicates that this recent wave of CapEx expansion will considerably increase demand for AI servers, subsequently driving growth throughout the supply chain. This encompasses upstream components like GPUs/ASICs, memory, and packaging materials, as well as downstream areas such as liquid cooling modules, power systems, and ODM integration. Collectively, these factors will push the AI hardware ecosystem into a new phase of structural growth.
NVIDIA’s full-rack AI solutions are expected to see significant gains as CSPs ramp up CapEx. The combined shipments of GB300 and VR200 in 2026 are now projected to outperform previous projections, with the top five North American CSPs remaining the primary customers. Oracle is likely to experience the most substantial growth, driven by U.S. government cloud initiatives and AI database leasing services.
Accelerated by NVIDIA’s strong market momentum, 2026 is expected to see wider adoption of full-rack AI architectures. NVIDIA plans to introduce its next-generation VR200 rack, while facing increased competition from AMD's Helios full-rack platform, which features Venice CPUs and MI400 GPUs. Meta and Oracle will be the initial users of Helios. Additionally, Meta aims to diversify by deploying NVIDIA GB/VR racks and developing its own ASIC solutions, in line with its goal to increase CapEx by 65% in 2026 to reach $118 billion.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/07/2025 | Marcy LaRont, I-Connect007In electronics industry news, my picks start with Pete Starkey’s review of EIPC’s latest Technology Snapshot webinar. With all eyes on Europe as a pressure lever for ESG worldwide, Pete’s coverage is a must-read. Next, I want you to check out the new column by Leo Lambert on EPTAC, who provides a solid and complete overview of UHDI from concept to assembly.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
Marcy’s Musings: Can You Hear the Voices?
04/16/2025 | Marcy LaRont -- Column: Marcy's MusingsTariffs, CapEx spending, the war in Ukraine, and domestic and global economies: I wanted to know what’s on your minds as we launch headlong into Q2 2025. So, this month, I’m highlighting industry voices and how they feel about their businesses, the effects of a new U.S. administration, and where technology is heading.
Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations
04/09/2025 | Real Time with...IPC APEX EXPOMark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.
Imagine the Possibilities: Tech Conference 2025
03/05/2025 | Marcy LaRont, I-Connect007As we approach the 25th anniversary of IPC APEX EXPO, excitement buzzes around the annual Technical Program. Coming off a tremendously successful program in 2024—co-hosted with ECWC16 and with a significant global presence—organizers wanted to match that same level of engagement. In this interview, Stan Rak of SF Rak Company and Udo Welzel of Robert Bosch Mobility Electronics, co-chairs of the Technical Program Committee (TPC), highlight efforts of the volunteer committee to bring another quality technical program to life.