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Advanced Electronics Packaging Digest

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Curtiss-Wright Wins $40M Leidos Contracts for U.S. Army Defense Program

09/01/2026 | Curtiss-Wright Corporation
Curtiss-Wright Corporation announced that it has been awarded contracts by Leidos valued at approximately $40 million to support the production of the U.S. Army’s Indirect Fire Protection Capability Increment 2 (IFPC Inc 2) system.

Elementary, Mr. Watson: PCB Design Is a Team Sport (Revisited)

08/27/2026 | John Watson -- Column: Elementary, Mr. Watson
At the Tokyo 2020 Olympics, the U.S. men’s 4x100-meter relay team of Trayvon Bromell, Fred Kerley, Ronnie Baker, and Cravon Gillespie was expected to contend for gold. With some of the fastest sprinters in the world, simply reaching the final seemed almost certain. Instead, the heavily favored team finished sixth in its qualifying heat and failed to advance, missing the final by just two-hundredths of a second. This massive disappointment was not due to a lack of individual speed but to a poorly executed baton exchange between Kerley and Baker, which forced both runners to slow down at the most critical moment.

Target Condition: Flex and Rigid-flex Solutions in A&D Display Electronics

07/21/2026 | Kelly Dack -- Column: Target Condition
Displays and illuminated human-machine interfaces have become essential components of modern electronic systems. From aircraft cockpits and mission-control displays to medical equipment, industrial controls, and consumer devices, we depend on these visual interfaces to interact with technology. I recently spoke with Pioneer Circuits' Applications Engineer Dan Hansler, and Sales and Marketing Director Ruben Lugo about how decades of aerospace and defense (A&D) experience are influencing today's lighting and display designs.

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.

Rethinking Stackup, Materials, and Tolerances in Modern Designs

05/18/2026 | Kristin Moyer, Global Electronics Association
The simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
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