Mycronic Presents the Next Level of Flexible PCB Assembly at productronica 2025

Estimated reading time: 4 minutes

Mycronic is a leading Sweden-based electronics assembly solutions provider and invites visitors to explore their next innovations and discover the factory of the future at productronica 2025, November 18–21 in Munich, at booth A3.249.

Attendees can experience Mycronic’s latest innovations and new product launches to flex their manufacturing flow. 

Mycronic experts in printing, placement, inspection, material handling, and factory connectivity will present the latest innovations at Productronica. Visitors will have the chance to explore new PCB assembly products and solutions designed to meet evolving industry demands, and to engage directly with Mycronic’s team of experts.

"We are excited to demonstrate our commitment to innovation excellence and customer-centric product development. Through strategic collaboration between our R&D, engineering, and product teams — guided by direct customer insights — we will showcase enhanced flexibility across our solution offerings that directly address the evolving demands of today's market," said Clemens Jargon, Sr. Vice President of PCB Assembly Solutions.

Introducing the new GenI™ Generative AOI Programming

Mycronic announces the release of GenI, the first of its kind to autonomously create production-ready 3D AOI inspection programs based solely on pick-and-place data and initial 3D AOI scan.

This gives PCB manufacturers the power of inline 3D AOI metrology for each batch, without programming downtime. Now, manufacturers can introduce any new product, any new component, and any new layout with total confidence – and have complete programming freedom.

New big board capabilities

The next manufacturing flex from Mycronic is the launch of MYPro A41DX and A41SX

- delivering greater adaptability, efficiency, and performance for tomorrow’s production demands.

Big-board PCB assembly is critical for industries and allowing the ability to produce boards that are up to 1,000 mm x 609 mm in size and a thickness of 12.5 mm. From telecom, server, defense and aerospace, larger boards reduce interconnect complexity, improve durability, and cut production costs.

Mycronic’s big board machines enhance the customer’s possibilities through enabling production of large boards on the MYPro A41 series. This next series will come with all the other benefits that came with the introduction of the A40 series of machines. For example, the MX7 mounthead places a significantly larger range of components of any size with perfect precision on a large substrate.

The A41 series offers high flexibility with increased board dimensions with a thickness up to 12.5 mm and up to 10 kilograms. This is the first pick-and-place unit(s) for large PCB production and are set for delivery in December 2025.

MYPro Create

One dataset. One program. One workflow.

Multi-machine programming just got a lot smoother. At the beginning of 2025, Mycronic rolled out the new MYPro Create, eliminating the need for customers to operate multiple software programs and spending hours on repetitive data entry.

With MYPro Create you have an all-in-one solution for effortless job creation across Mycronic Jet Printers, SPI, and AOI machines from the same data set to achieve fast and streamlined programming.

BA 01 small dot ejector for dispensing flexibility in jet printing 

Introducing the new BA 01 small dot ejector—engineered to redefine flexibility in jet printing for precision, efficiency, and more flexibility.

The small dot dispensing is engineered to meet the demands of modern PCB design, delivering high flexibility and significant performance enhancements for (small) dot volume, size, and pad pitch.

• Minimum dot volume reduced from 1.9 nL to 1.0 nL
• Minimum dot size reduced from 215 µm to 180 µm
• Minimum pad pitch improved from 0.4 mm to 0.35 mm

As PCBs continue to increase in complexity and size, challenges such as board stretch or shrinkage become more common. Advanced jet printing solutions for large and ultra-slim PCBs are uniquely capable of adapting these changes in real-time, an essential feature for maintaining high yield when working with small pads and fine-pitch components.

Existing MY700 Jet Printer users of electronic manufacturing looking for flexible, high-yield solder paste printing, can achieve smaller fine print pitch with accurate and efficient results when using the BA 01 small dot ejector.

Integrated full-line solution

MYPro Line assembly solutions are engineered to keep Mycronic customers in control of changing workflows. With end-to-end integrated process control, the full-line can include pick-and-place machines, stencil and jet printers, inspection, and material handling.

Mycronic provides software and hardware integrations with the latest AI-assisted workflows, transforming production data into real-time productivity gains. As markets evolve, supply chains shift, and technologies change, and the full-line helps customers build a factory that goes with their unique flow.

“In an industry characterized by rapid technological advancement and increasingly sophisticated customer requirements, our ability to rapidly integrate customer feedback into our development cycles ensures we minimize operational disruption while maximizing value delivery. This agile approach to innovation reinforces our position as a technology leader and trusted partner in our customers' success,” Jargon said.

Visit Mycronic at Productronica 2025 in Munich, Germany November 18-21 at booth A3.249 to experience live demos and to learn more about Mycronic’s full-line, next gen software and connectivity solutions that help electronic manufacturers flex their factory flow.