VORAGO Launches Radiation-Tolerant Chips for Next-Gen Satellite Constellations

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The booming satellite industry just received a massive cost-saving injection paired with unprecedented ease of integration. VORAGO Technologies announced a world first: the launch of four radiation-tolerant microcontrollers purpose-built for low Earth orbit (LEO) markets at a fraction of the cost of traditional space-grade components, with first chips shipping in early Q1 2026.

The world leader in rugged, radiation-hardened chips protected with HARDSIL® technology, Vorago is now democratizing access to its highest-reliability solutions to immediately benefit the explosion of commercial and government LEO operators and satellite constellations.

Meeting the Demands of the Satellite Boom

As satellite constellations multiply, the demand for electronics that can withstand the extreme radiation and thermal dynamics of space is surging. Satellites in orbit are projected to double by 2030, reaching 58,000-100,000 versus 12,000 today and just 5,000 a few years ago. Key demand drivers include:

• LEO mega-constellations (for example, Starlink, Project Kuiper, Eutelsat OneWeb)
• Constellations for communications, media, and scientific research, enabling broadband networks, content distribution, and large-scale data collection.

Until now, high reliability meant high costs, bulky components, and more complex integration reserved for deep-space and defense missions. Vorago changes the equation by making its breakthrough microcontrollers affordable to use in Earth’s low, medium, and geospatial orbits for the first time—bridging the gap between standard upscreened commercial electronics and fully radiation-hardened chips to deliver dependable performance at a lower cost.

Four new Radiation-Tolerant by Design (RTbD) microcontrollers using trusted ARM® Cortex® M4-based cores join VORAGO’s expanding VA4 family—including the extended-mission VA42620/VA42630 and the cost-optimized VA42628/VA42629 for short or lower orbit missions. Superior radiation protection is embedded directly into the silicon to solve the reliability challenges of satellite constellations while improving on the inefficient, multi-chip redundancy approach.

“Space systems can’t afford downtime, and they can’t afford to fail in orbit. Debris now rivals active satellites for space in many low-orbit areas,” said Bernd Lienhard, CEO of Vorago Technologies. “As more companies move into space, the expanded VA4 family delivers the reliability needed to operate satellites in orbit and complete their missions securely, without requiring three backup systems to get there. It’s a smarter, more sustainable way to scale satellite constellations without contributing to space junk.”

Lienhard added, “Our ‘rad-tolerance by design’ approach—versus upscreening after the fact—significantly cuts weight, complexity, and waste while maintaining mission assurance.”

Deep-Space Heritage Meets LEO Growth

With this news, the VA4 product family now offers both rad-tolerant and rad-hardened options. Its current rad-hardened VA41630 recently achieved QML-Q+ certification—the highest government reliability assurance from the U.S. Defense Logistics Agency (DLA). This certifies both the product and the manufacturing process for demanding military and space applications. Notably, Vorago is the first small private chip designer and manufacturer (under 100 employees) to earn this designation and is now a DLA preferred small business supplier to streamline and increase government contracting.

Adding to this momentum, Vorago launched its first dual-core microcontroller—the VA5 family—last quarter. Using Arm® Cortex®-M55 cores, this family is available in both rad-tolerant and rad-hardened varieties. VA5 delivers maximum resiliency for complex missions like autonomous deep-space exploration, boasting 2x speed and 5x advanced capabilities, including AI/machine learning and a built-in motor control kit for high-precision satellite actuation.

Today, the company builds on its 20-year deep-space legacy by bringing competitive, high-reliability chips to a wider variety of customers. Built for use at any orbital level, the new product differ by resilience: the extended-mission VA42620/VA42630 for harsher orbits and primary flight control, and the cost-optimized VA42628/VA42629 for thermal regulation and localized power management. Both tiers deliver top price/performance and fast scalability. Key features include:

• Zero Redesign: The chips can be dropped into existing architectures, eliminating the time and cost associated with platform redesigns and ensuring rapid deployment.
• Most Compact Package: With built-in memory options, the chips deliver a high-density solution for missions where every cubic centimeter is precious.
• Up to 75% Cost Savings: Commercial satellite and LEO operators benefit from rad-tolerant by design (RTbD) reliability with big cost savings versus rad-hardened products.

Built for Resilience in Orbit

Compact and flexible, the new VA4 rad-tolerant products are ideal for companies building satellite constellations, Earth observation systems, and next-generation communications networks. The new chips have already caught the attention of aerospace and satellite engineering customers.

“As an early VA4 customer, we’ve seen firsthand how Vorago’s technology changes what’s possible,” said Keith Szewczyk, Vice President, Kyocera-AVX Components. “They’re the only semiconductor company giving us the flexibility to scale radiation-tolerant microcontrollers across multiple orbits and at multiple price points. That means we can deliver the reliability our satellite developer customers expect—faster, more efficiently, and at a price that makes ambitious missions achievable.”