EpoxySet to Showcase Extensive line of Biocompatible Adhesives at MD&M West
December 9, 2025 | epoxySetEstimated reading time: Less than a minute
EpoxySet Inc. will be featuring the expanded line of adhesives, sealing, encapsulating and coating materials certified for biocompatibility at MD&M West on February 3-5, 2026, at the Anaheim Convention Center, Anaheim, CA, Booth 711.
This broad line of epoxies and urethanes are ISO-10993-5 approved. These are used extensively in medical devices manufacturing. Most common applications include sensors, PCBs, instruments, hearing aids, ultrasound probes, pacemakers, MRIs, endoscopes and catheter products. Many of these systems can withstand sterilization techniques such as autoclave, gamma radiation and EO sterilization.
The product line includes products that can withstand 300°C or be temperature cycled down to 4°K. Many biocompatible materials are optically clear or electrically/thermally conductive. Specific products are designed for structural requirements exhibiting very high bond strength. Some chemistries can be cured at room temperature, heat or UV, allowing for production flexibility.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Unitemp Launches ESPEC Deep Capacity HAST Chamber in UK for Large PCB Testing
03/24/2026 | UnitempA new deep‑capacity Highly Accelerated Stress Test (HAST) chamber capable of accommodating large multilayer PCBs and high specimen volumes is now available in the UK, as Unitemp introduces ESPEC’s latest model, the EHS‑222M‑L.
SEEQC Unveils Integrated Qubit Control Quantum Chip
03/19/2026 | BUSINESS WIRESEEQC announced a significant breakthrough in the development of scalable, chip-based quantum computers, with results published in a peer-reviewed study in Nature Electronics.
Indium Corporation Experts to Present on Array of Solder and Thermal Management Solutions at APEX EXPO 2026
03/12/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics at APEX EXPO 2026, March 17-19, in Anaheim, California.
T-type Thermocouples in Foil Heater Technology
03/12/2026 | Zack Schaner, Flexible Circuit TechnologiesThis article examines the use of T-type thermocouples implemented with flexible printed circuit and etched foil heater technology, focusing on their design, fabrication, and integration into advanced thermal management systems. I’ll give particular attention to how their low-profile construction, accuracy at low temperatures, and mechanical robustness make them well-suited for critical devices operating in demanding environments