Marcy’s Musings: Operating Without a Rulebook
It’s Only Common Sense: Hire for Hunger, Train for Skill
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
Malaysia Advances Semiconductor Manufacturing Footprint with CHIPX
December 12, 2025 | CHIPXEstimated reading time: 1 minute
CHIPX™, a next-generation semiconductor and photonics manufacturer, today announced plans to establish a state-of-the-art, 8-inch wafer fabrication facility in Malaysia, the first of its kind in the ASEAN region. The facility will introduce advanced GaN/SiC manufacturing, driving Malaysia’s entry into front-end semiconductor production and accelerating domestic capability in photonics, high-bandwidth optical interconnects, and advanced materials engineering essential to next-generation AI and high-performance compute systems.
CHIPX™ is establishing advanced front-end manufacturing capabilities in Malaysia, spanning infrastructure, R&D, engineering teams, talent development programs, and structured technology-transfer initiatives that build local expertise. Leveraging Malaysia’s emerging silicon-photonics ecosystem, CHIPX will provide the fabrication foundation for next-generation transceivers and receivers, enabling ultra-high-speed connectivity for AI data centres and intelligent systems.
"Malaysia is emerging as a leader in the next wave of semiconductor and photonics innovation,” said Chinmoy Baruah, CEO and Founder, CHIPX™. “We are bringing advanced front-end manufacturing and photonics capabilities to Malaysia to accelerate the country’s move into front-end semiconductor production and to establish the ultra-high-bandwidth, energy-optimized compute architectures required to scale the next generation of AI systems."
CHIPX™ is executing the venture with strategic international investors and leading Taiwanese semiconductor partners to bring advanced engineering depth into Malaysia’s semiconductor ecosystem. Reflected in this collaboration is CHIPX’s long-term commitment to building high-performance, energy optimized front-end semiconductor capabilities in the region.
The project aligns with Malaysia’s key industrial policy frameworks – including the National Semiconductor Strategy, the New Industrial Master Plan (NIMP 2030), and the National Energy Transition Roadmap – by supporting national efforts to develop a resilient, competitive, and sustainable semiconductor sector.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SEMI Europe Policy Forum 2026 in Brussels to Focus on Chips Act 2.0
04/16/2026 | SEMIThe SEMI Europe Policy Forum Brussels 2026 to be held on June 3 will bring together industry leaders, economists, policymakers, and technology experts to examine how geopolitical dynamics are transforming the global semiconductor landscape and to identify concrete pathways for reinforcing Europe’s leadership role.
Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.
EdgeCortix Secures Investment from Axiro Semiconductor, MPower Partners for Edge AI
04/15/2026 | BUSINESS WIREEdgeCortix, a leading fabless semiconductor company specializing in energy-efficient AI processing at the edge, announced a new investment from Axiro Semiconductor Pvt. Ltd., a wholly owned subsidiary of CG Power and Industrial Solutions, and MPower Partners, a Japan-based global venture capital fund, building on the strong momentum of its previously oversubscribed funding round.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
SEMI Europe Policy Forum Brussels 2026 to Focus on Chips Act 2.0 in Shaping the Future of Europe's Semiconductor Industry
04/14/2026 | SEMIThe SEMI Europe Policy Forum Brussels 2026 to be held on June 3 will bring together industry leaders, economists, policymakers, and technology experts to examine how geopolitical dynamics are transforming the global semiconductor landscape and to identify concrete pathways for reinforcing Europe’s leadership role. Registration is open.