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Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Altair HyperWorks 2026 Delivers Design and Simulation at Scale with AI
December 16, 2025 | AltairEstimated reading time: 3 minutes
Altair, a global leader in computational intelligence and now part of leading technology company, Siemens, announced the latest updates to HyperWorks® 2026 software. With significant advances in AI, high-performance computing (HPC), and multiphysics integration, HyperWorks 2026 enables engineering teams to accelerate innovation and improve product performance across industries using comprehensive computer-aided engineering (CAE) design and simulation.
“HyperWorks 2026 exemplifies how Altair and Siemens are driving the future of simulation and empowering engineers to design smarter, faster, and with greater confidence in real-world outcomes by bringing AI, automation, and multiphysics into a unified ecosystem,” said Sam Mahalingam, chief technology officer, Altair, and executive vice president, Siemens Digital Industries Software. “Following the acquisition by Siemens earlier this year, our commitment is to create the world's most complete AI-powered portfolio of product lifecycle intelligence software and further enhance the most comprehensive digital twin.”
HyperWorks in use at JetZero
JetZero, a pioneering aviation startup building the future of ultra-efficient air travel, is collaborating with Siemens on the development and production of JetZero's revolutionary blended wing aircraft. The innovative all-wing design aims to improve fuel efficiency by up to 50 percent, reduce noise, and advance the industry toward zero carbon emissions. Key to the fast pace of its development schedule is gaining engineering insights faster than using conventional high fidelity computational fluid dynamics (CFD) with FlightStream, part of the HyperWorks suite.
As John Vassberg, chief design officer at JetZero explains, “JetZero is pioneering the next step change in the aerospace industry and, to accomplish that at the scale the industry is demanding, means we need a toolset that allows us to work at pace and gain accurate insights early in design – which FlightStream does. It is easy for our engineering team to use, does not require the traditional high-performance computing resources of high-fidelity CFD, and gets us answers fast and without heavy resource demands. This is critical for companies like JetZero that need to iterate faster than ever before.”
HyperWorks 2026 delivers six key innovations
AI-powered design and simulation
Geometric deep learning and generative algorithms and GPU-accelerated reduced order modeling (ROM) enable near-real-time predictions and faster validation. Physics-based AI models can be deployed in secure, browser-based environments, producing results up to 1,000x faster than traditional solver simulations. Expanded support for vectors and smoothed-particle hydrodynamics (SPH) broadens domain coverage.
Enterprise-scale pre-processing and model assembly
Engineers can now simulate large, complex assemblies with speed and fluidity, shortening build and validation cycles. Enhanced navigation, batch meshing, and connector management streamline pre-processing while direct data management integration helps to ensure consistency across teams.
Integrated multiphysics simulation
Unified solvers and domain coupling allow engineers to analyze complex interactions – such as thermal-fluid or electromagnetic-structural systems – with greater fidelity. New workflows support e-motor optimization, battery safety studies, and high-temperature analysis, while co-simulation standards enhance digital continuity. Electromagnetic simulations run up to 40 percent faster and propagation modeling up to 20x faster with radar and electromagnetic compatibility (EMC) analysis expanded for next-generation applications.
Automation, collaboration and connectivity
Expanded Python and API support, intuitive no-code workflow tools, and cloud integration promote digital continuity. Enhanced visualization and plotting tools simplify result interpretation and sharing, while seamless interoperability with third-party software strengthens digital twin fidelity.
Realistic particle, fluid, and material behavior
New modeling approaches capture bulk flow, impact behavior, and high-temperature effects with greater realism. Python-based automation accelerates discrete element method (DEM) workflows and coupled solvers enable advanced studies of battery safety and material response.
Intuitive design and motion exploration
A more unified workspace transforms how engineers explore motion and refine geometry. Real-time updates across multi-window views reduce setup time, while flexible implicit modeling and direct surface editing remove geometry barriers to creativity. With clear side-by-side comparisons, teams can make faster, more confident decisions.
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Klaus Koziol - atgSuggested Items
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.