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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Why AI/ML May Be the Next Big Step for PCB Fabs
December 23, 2025 | Sydney Xiao, Global Electronics Association East AsiaEstimated reading time: 1 minute
PCB manufacturing is approaching a pivotal moment across the global electronics supply chain. For decades, the industry grew by adding equipment, expanding capacity, and relying on the accumulated experience of seasoned engineers. Today, the landscape is shaped by rising product complexity, increasingly sensitive material systems, tighter delivery expectations, and a worldwide shortage of technical talent. The traditional model is nearing its limits.
This is precisely why artificial intelligence (AI) and machine learning (ML) are entering the mainstream conversation—not as abstract concepts or futuristic visions, but as practical capabilities that address the most pressing challenges PCB fabs now face: predictability, stability, cross-process understanding, and the ability to manage complexity at a scale humans alone can no longer handle.
Why PCB Fabs Are ‘Needy’ for AI/ML
PCB fabrication is a long, interdependent chain of processes. Lamination affects drilling, drilling influences plating, plating affects imaging, and so on. Small deviations cause ripples in ways that even experienced engineers may not fully anticipate. As product requirements rise, decision-making based solely on individual experience becomes increasingly fragile.
At the same time, the industry faces a structural shift: fewer young professionals are choosing factory careers, and knowledge is becoming more concentrated than ever and is becoming increasingly difficult to transfer. The result is a growing gap between what fabs need and what traditional engineering models can supply.
To continue reading this article, which originally appeared in the December 2025 editon of PCB007 Magazine, click here.
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From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
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