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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Dymax to Showcase PCB Protection and Thermal-Stress Solutions at SMTA Guadalajara

09/25/2026 | Dymax
Dymax, a global manufacturer of light-curing adhesives and equipment, will exhibit at SMTA Guadalajara, October 7-8, booth 830, where visitors can discover light-curing solutions designed to help manufacturers improve efficiency, reliability, and process performance.

Keysight Enables UC Berkeley Research to Advance 6G Over-the-Air Testing

09/25/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced a new collaboration supporting research at the Berkeley Wireless Research Center (BWRC) that aims to accelerate and improve testing of next-generation wireless devices.

TROOPS Invests $12M in Southeast Asia AI Infrastructure Unit

09/24/2026 | ACN Newswire
TROOPS, Inc. is committing US$12 million to start a new business unit focused on artificial intelligence infrastructure in Southeast Asia, a growing market that attracted more than US$55 billion of investment over the last year.

The Factory of the Future Still Needs People

09/23/2026 | Michael Gleason, GreenSource Fabrication
Modern PCB factories can incorporate sophisticated automation, advanced process controls, machine vision, extensive traceability, real-time data collection, predictive analytics, and AI. These technologies are enabling manufacturers to see, measure, and identify opportunities that once depended almost entirely on human observation. They also create an opportunity to think differently about the manufacturing workforce. The factory of the future brings technology and human expertise together, allowing each to contribute where it creates the greatest value.

Latest Episode of Qnity Podcast Series Explores Materials for Mission-Critical Reliability

09/25/2026 | I-Connect007
The second episode of Engineering What’s Next, a podcast series from Qnity, is now available on I-Connect007. The series explores the materials, technologies, and expertise shaping the next generation of electronics. In “Materials for Mission-Critical Reliability,” host Marcy LaRont speaks with Rich Wessel, Industrial Application Leader, Laminates, about the increasingly complex demands placed on materials as electronics move into more challenging and mission-critical applications.
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