Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Marcy’s Musings: Looking Forward—APEX EXPO 2026 (and AI Design Tools Too)

02/18/2026 | Marcy LaRont -- Column: Marcy's Musings
This month, I-Connect007 Magazine previews APEX EXPO 2026, from exhibitors and special events on the show floor to new insights from the technical conference, details on keynotes, and advancements in critical industry standards. The show also has an international flavor, so we’ve included links to articles from Mexico, East Asia, and India. For PCB designers, we focused on AI in design tools, which turns out to be much more than the dreaded auto-router. We've got articles from Zuken, Siemens, and AllSpice.io.

Neways Begins Delivery of Saab’s UTAAS Integrated Sight and Fire Control Systems

02/11/2026 | Neways
Neways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, has started production and delivery of critical sub-systems for Saab’s UTAAS (Universal Tank and Anti-Aircraft System) integrated sight and fire control systems for BAE Systems’ CV90 infantry fighting vehicles.

EIPC Winter Conference 2026 Review: The Keynote Sessions

02/11/2026 | Pete Starkey, I-Connect007
Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.

Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026

02/10/2026 | TrendForce
Google’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design.

Qnity Introduces First Ceria PCMP Clean for Advanced, Sustainable Semiconductor Manufacturing

02/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced its first post-chemical mechanical planarization (PCMP) cleaning solution designed specifically for ceria applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in