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Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging

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The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.

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In an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.

Elementary, Mr. Watson: Design Intent Over Design Speed

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I was recently asked a simple but powerful question: Is there anything available to PCB designers today that would be truly advantageous to them that they’re essentially not using? My answer was yes. However, it reminded me of an experience before Christmas one year when I was killing time at the mall. I had wandered into an Apple Store to look around, and I overheard a customer say, “Yeah, I just need a phone.”
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