The Marketing Minute: Blink and You'll Miss It … and Other Problems With One-shot Marketing
The Right Approach: Reflections on 50 Years in the Business, Part 1
It’s Only Common Sense: Control Your Market With Your Actions
Pre-Registration Opens for Chiplet Summit, the Premier Chiplet Event
January 16, 2026 | BUSINESS WIREEstimated reading time: Less than a minute
Chiplet Summit opened pre-registration for its fourth annual event, taking place February 17-19 at the Santa Clara Convention Center. Major chipmakers have all adopted chiplets for leading-edge performance, and the Chiplet Summit brings together the engineers and companies shaping the future of integration.
The timely and practical educational sessions presented at Chiplet Summit focus on the tools, methods, and platforms shaping chiplet-based systems. Attendees will gain insight into advanced packaging, high-bandwidth memory (HBM), and methods for accelerating heterogeneous integration and testing – education not available at any other event.
Keynotes from Synopsys, Alphawave Semi, Arm, Cadence, Siemens, Marvell, UCIe Consortium, and Open Compute Project (OCP) will explore trends and roadmaps for processors, communications devices, and AI chips for cores and edge applications.
“In 2026, we expect to see the full impact of chiplets,” said Chuck Sobey, Summit General Chair. “They are ideal for AI accelerators that require huge advances in throughput, power consumption, and latency.”
Chiplet Summit will also feature exhibits from industry leaders including Synopsys, Alphawave Semi, Teradyne, Cadence, Keysight, Siemens EDA, and Marvell, with more than 1,500 attendees expected.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
FLEX Technology Summit 2026 Spotlights Augmenting Flexible Hybrid Electronics with AI, Digital Twins, and XR
01/23/2026 | SEMIThe FLEX Technology Summit will be held on February 24-26, 2026, at the Wigwam Arizona Resort in Phoenix, Arizona, celebrating 25 years of innovation in flexible hybrid electronics (FHE), printed electronics, and advanced packaging.
WHMA to Host 2026 Annual Global Leadership Summit
01/02/2026 | Global Electronics AssociationThe Wire Harness Manufacturers Association (WHMA) will host its 2026 Annual Global Leadership Summit from January 27 to 29, 2026, bringing together executives from wire harness manufacturers, OEMs, and suppliers.
Hardware Engineers, Manufacturing Leaders Ready to ‘Build Better’ Electronics
10/06/2025 | Marcy LaRont, I-Connect007According to Instrumental’s dynamic CEO, Anna-Katrina Shedletsky, the Build Better Electronics Manufacturing Summit on Sept. 30 was a passion project meant to provide a forum for hardware engineering senior leadership, who have very busy jobs and limited opportunities, to share information, thought leadership, and networking opportunities. “Build Better is really about cross-pollination and sharing,” she said, as she highlighted the importance of supporting this type of sharing in tech, which may be more important than ever before.
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.