Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense
Defense Speak Interpreted: Hypersonics Report Back After Six Years of Silence
American Made Advocacy: American Microelectronics Power the Future of High Technology
Announcing the New, Integrated I-Connect007 Magazine
January 20, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Design and fabrication have always been closely connected, but the rising demands for reliability, performance, and cost efficiency now require a closer alignment than ever before.
To that end, we are excited to launch I-Connect007 Magazine, which brings our Design007 Magazine and PCB007 Magazine under a single title. This evolution enables us to present a more comprehensive view of the PCB and interconnect lifecycle while maintaining the depth, technical rigor, and practical focus that you expect.
So, what’s in this issue? This month, we asked designers, fabricators, and suppliers what they see for 2026 and beyond and you’re likely to see your own thoughts reflected in their commentary. On the design side, you’ll find articles ranging from the greatest challenges to PCB designers to technical topics on 3D design and pattern plating, optimization to the IPC-2152 specification, and the evolution of flexible circuits. We also give you a preview of the Design Village at APEX EXPO.
In PCB fabrication, fabricators and suppliers also look ahead at the challenges of adapting to changes we cannot yet see whether that’s in additive manufacturing technology, building machines for the next phase of technology, or where PCB fabrication will lead in Europe.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Teradyne Acquires TestInsight, Accelerating Time to Market for AI and Data Center Devices
04/16/2026 | BUSINESS WIRETeradyne, Inc., a leading provider of automated test equipment (ATE) and advanced robotics, announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry.
Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design SystemsCadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
April Issue of I-Connect007 Magazine: Beyond the Rulebook
04/14/2026 | I-Connect007 Editorial TeamIn this month’s I-Connect007 Magazine, we asked PCB designers, fabricators, and suppliers what it really means to operate without a rulebook. Their perspectives vary, especially between seasoned designers and experienced fabricators, but a common thread emerges: progress depends on pushing boundaries and finding a way forward, even when the path isn’t clear. In many ways, this mindset has always been part of what we do, whether we’ve called it that or not.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.