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Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment

05/30/2025 | Microsembly
Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.

Indium to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

01/22/2025 | Indium Corporation
Indium Corporation will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California. SPIE West is the world’s premier event for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.

Indium to Showcase Precision Gold Solder Solutions at MD&M West 2025

01/08/2025 | Indium Corporation
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, taking place February 4-6 in Anaheim, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.

Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024

11/18/2024 | Indium Corporation
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.

Intel Foundry Achieves Major Milestones

08/07/2024 | Intel
Intel announced that its lead products on Intel 18A, Panther Lake (AI PC client processor) and Clearwater Forest (server processor), are out of the fab and have powered-on and booted operating systems.
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