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Keiron Printing Technologies Appoints BarTron as Midwest & Ohio Valley Sales Rep
January 29, 2026 | Keiron Printing TechnologiesEstimated reading time: 1 minute
Keiron Printing Technologies, a global innovator in advanced electronics manufacturing solutions, announced that it has appointed BarTron, Inc. as its authorized sales representative for Michigan, Ohio, Western Pennsylvania, Indiana, and Kentucky. BarTron will support the introduction and regional adoption of Keiron’s LiFT (Laser-Induced Forward Transfer) technology, including the company’s latest innovation, the Keiron HF2 LiFT Printer.
Founded in July 1989, BarTron, Inc. has built a strong reputation for helping manufacturers solve complex process and production challenges. Through close collaboration with customers and technology partners, BarTron plays a key role in evaluating, implementing, and supporting advanced manufacturing solutions across the electronics assembly industry.
Keiron’s LiFT technology replaces traditional stencil- and nozzle-based solder paste deposition with a laser-driven, non-contact digital process. By eliminating stencils, nozzles, ejectors, and other mechanical contact points, LiFT removes a major source of variability in the SMT process while directly addressing one of the leading causes of assembly defects: inconsistent solder paste application.
The HF2 LiFT Printer enables precise, repeatable solder paste deposition down to nanoliter volumes while working with standard solder pastes and accepting common CAD, Gerber, and ODB++ files. This allows manufacturers to adopt digital solder paste printing without changing materials or reworking existing workflows. With no stencils to fabricate, clean, or store, changeovers can be completed in minutes rather than hours—making the system well suited for high-mix and NPI-driven production environments.
A key differentiator of the HF2 printer is its integrated Solder Paste Volume Metrology (SPVM), which measures every deposit during the printing process. This built-in verification improves first-pass yield while reducing rework and scrap, without the need for a separate SPI system. The contactless architecture also eliminates common reliability issues associated with clogging, wear, and alignment drift found in traditional printing technologies.
“BarTron’s technical depth and customer-focused approach make them an ideal partner as we expand access to LiFT technology,” said Brian Duffey, President of Keiron Technologies USA. “Their ability to guide manufacturers through evaluation and adoption will be instrumental in bringing the HF2 printer into production environments across the region.”
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03/05/2026 | SolderKingSolderKing Assembly Materials has launched SAC0307, a new low-silver addition to its SK P2-5 solder paste range.
KOKI Showcases BIG Low-Ag and ICT-ready Solutions at APEX EXPO 2026
03/05/2026 | KOKIKOKI Solder America, a global leader in advanced soldering materialsannounces that it will be exhibiting at APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California.
Microscreen Expands New England Coverage for High-Precision SMT Stencils
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Indium Corporation to Showcase High-Reliability Solder Technology at APEX EXPO 2026
03/04/2026 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at APEX EXPO 2026, March 17-19, in Anaheim, California.
CIL Brings Advanced Semiconductor Solder Bumping to the UK
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