Veritiv Acquires Pack4
February 4, 2026 | PRNewswireEstimated reading time: 1 minute
Veritiv Operating Company, a leader in specialty packaging solutions, announced that it has acquired Pack4, LLC, a Boston-based distributor and fabricator of custom protective packaging products serving healthcare, electronics, and food & beverage markets.
"This acquisition expands Veritiv's presence in the New England market while adding value‑added custom protective packaging capabilities to our portfolio," said Sal Abbate, Chief Executive Officer of Veritiv. "Pack4's strong customer relationships, deep expertise in the high‑growth healthcare sector, and experienced team will help us compete more effectively in New England and deliver even greater value to our customers."
The acquisition of Pack4 complements Veritiv's specialty packaging business, enhances its capabilities to serve premium brands, and strengthens the company's end-to-end packaging solutions. These combined abilities strengthen Veritiv's position as a leader in the packaging industry, enabling the company to deliver innovative, customized solutions that meet the needs of today's brands and industries.
"Joining Veritiv marks an exciting new chapter for Pack4," said Jim Barenboim, CEO and owner of Pack4, LLC. "With Veritiv's resources and expertise in packaging distribution, automation, design, and fulfillment, our team is well-positioned to grow and deliver even greater value to our customers."
Pack4 operates facilities in Lawrence, Massachusetts and Puerto Rico. The company specializes in custom protective packaging products, including foam, corrugated, tapes, bags, and stretch wrap, and serves a diverse range of industries with a focus on quality and service.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Amkor Technology Announces Q4 and Full-Year 2025 Financial Results
02/13/2026 | Amkor TechnologyAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced financial results for the fourth quarter and full year ended December 31, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/13/2026 | Michelle Te, I-Connect007This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.
New Research Group: AT&S Strengthens Microelectronics at TU Graz
02/11/2026 | AT&SAT&S is setting another strategic milestone for the technological future of Europe and is funding the establishment of a new research group at Graz University of Technology (TU Graz) in the field of microelectronics with a focus on IC substrates and advanced packaging technologies.
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
02/11/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
FICG Highlights Advanced Packaging Integration for Optical Transceivers at APE 2026
02/04/2026 | PRNewswireFIC Global, Inc., with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place February 4–6, 2026 at Sands Expo and Convention Centre, Singapore.