KYZEN to Showcase MICRONOX Power Electronics Cleaning Chemistries at IMAPS Device Packaging Conference 2026

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KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on Device Packaging scheduled to take place March 2-5 at the Sheraton Grand at Wild Horse Pass in Phoenix, AZ. The KYZEN clean team member Scott Cain will be on-site at Booth #108 providing information about power electronics cleaning chemistries MICRONOX MX2120-LF, MX2123, and MX2127.

With the continued rise in demand for high-performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like those from the MICRONOX line and process optimization services to meet the array of challenges faced by manufacturers.

MICRONOX MX2120-LF is an aqueous, single-phase solvent designed to remove flux residue after die-attach on DBC substrates. MX2120-LF is designed to be effective in in-line SIA cleaning systems and provides outstanding cleaning performance and metal compatibility, leaving great metal surface conditions.

MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning.

MICRONOX MX2127 is a single-phase aqueous chemistry designed to remove lead-free flux residues from all types of IGBT module devices utilizing copper and nickel DBC substrates. MX2127 leaves ideal surface conditions for post wire bond and potting processes after cleaning. It is also multi-media safe and has a long bath life providing a low cost of ownership.