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American Standard Circuits (ASC), a leading U.S. manufacturer of advanced printed circuit board solutions, has successfully manufactured and shipped multiple IC substrate designs incorporating 5 to 7 stacked microvias using the company’s advanced Ultra High Density Interconnect (UHDI) manufacturing platform.
The capability is the result of several years of targeted capital investment in laser drilling, via-fill metallization, ultra-thin dielectric processing, precision registration, and advanced inspection — enabling ASC to support complex IC packaging domestically.
Stacked microvias at this depth require exceptional process control due to cumulative alignment tolerances, copper filling reliability, material stability, and thermal stress management. ASC’s UHDI manufacturing infrastructure allows consistent fabrication of vertically interconnected structures that historically have been produced primarily offshore.
“This milestone reflects disciplined investment and process development over multiple years,” said Anaya Vardya, CEO of American Standard Circuits. “Producing IC substrate designs with up to seven stacked microvias demands tight control across drilling, imaging, plating, and lamination. Our goal has been to bring this level of technology capability into reliable domestic production.”
The capability supports a wide range of applications, including:
- Advanced semiconductor packaging
- AI and high-performance computing hardware
- RF and high-frequency modules
- Aerospace and defense electronics
- Miniaturized high-density assemblies
By expanding advanced interconnect capability in North America, ASC continues to strengthen supply chain resiliency for high-reliability electronics and emerging microelectronics programs.
“Customers want advanced technology without geographic risk,” Vardya added. “Our UHDI investments are focused on closing that gap — enabling complex designs to be built here with confidence.”
ASC continues ongoing investments in ultra-fine line imaging, laser via formation, copper via-fill plating, and high-resolution inspection to further expand advanced packaging and substrate-level manufacturing capabilities.
