Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series

04/09/2026 | I-Connect007
I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and Future of Electronics. Titled “Reliability Under Pressure—PCBs in Harsh Environments,” this episode explores the challenges of maintaining long-term performance in demanding applications like aerospace, automotive, and defense. Host Marcy LaRont speaks with Laura Martin, director of strategic markets at Isola, about what reliability truly means when printed circuit boards are pushed to their limits.

Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups

03/31/2026 | Happy Holden -- Column: Happy’s Tech Talk
Multilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.

Ventec Showcases Glass Free Revolution and Launches Chiplam Portfolio at APEX EXPO 2026.

03/11/2026 | Ventec International Group
Ventec International Group invites attendees of APEX EXPO 2026 to Booth 4642 to experience its Glass Free Revolution and the official launch of chiplam, a new high-performance materials portfolio for advanced semiconductor packaging and test applications.

EIPC Winter Conference Review: From Innovation to Qualification

02/13/2026 | Pete Starkey, I-Connect007
Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

Lockheed Martin Unveils LampreyMMAUV

02/10/2026 | Lockheed Martin
Lockheed Martin unveils the Lamprey Multi‑Mission Autonomous Undersea Vehicle (MMAUV), a breakthrough “plug-and‑play” submersible that gives U.S. and allied warfighters technological and strategic advantage in today’s contested maritime arena. 
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in