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1Finity Unveils Next-generation Optical Line System for the AI Era and Beyond
February 27, 2026 | 1FinityEstimated reading time: 1 minute
1Finity, a Fujitsu company and leading provider of global network solutions, introduced the Ultra Optical System L1000/L2000 Optical Line System (OLS) platform to address next-generation AI networking needs. This open, performance-optimized global platform, to be available in the Fall of this year, provides both core optical infrastructure for hyperscalers and cloud providers, and enables service providers to offer high-capacity managed optical services to their customers. These dual applications ensure high-capacity, peak performance, and reliable scalability for DCI, metro, and long-haul transport.
Achieving a strategic advantage in meeting AI service demands requires communication service providers, hyperscalers, and cloud providers to adopt line systems optimized for 800G and beyond. The L1000/2000 is a next-generation platform, purpose-built with an optimized Direct Attach (DA) architecture for high-capacity service transmission and rapid scaling while reducing power and space. Available in various shelf sizes with AC and DC power, it offers unmatched flexibility for any operating environment. This system guarantees reliable 800G and higher speeds, significantly lowering Total Cost of Ownership (TCO). Its future-proof design includes Multi-Rail transmission support, ensuring even greater long-term power and space efficiency.
Designed for multi-vendor operation, the L1000/L2000 OLS platform eliminates vendor lock-in and hidden costs. Its flexible, compact, modular architecture scales from 1 to 16 degrees across continuous C+L bands. An open WSS (Wavelength Selective Switch) ensures seamless operation for ROADM interoperability, which provides significant cost reduction and greater network element selection, utilizing modular building blocks for data center interconnect, metro, and long-haul networks.
The L1000/2000 OLS platform leverages advanced automation for proactive fiber maintenance, streamlined commissioning, and simplified management. It achieves smooth, glitch-free wavelength scaling across C+L bands. Integrated tools enable fiber connectivity verification, optimized wavelength design/planning, and deep diagnostics for proactive maintenance and swift resolution of fiber issues.
“The Ultra Optical System L1000/L2000 OLS empowers CSPs, Hyperscalers, and Cloud providers to reliably deliver optimized, managed fiber services and core optical infrastructure from the same simple, compact design that fits anywhere,” said Hideki Matsui, SVP, Head of Photonics System Business Unit at 1Finity Inc. “Providing open, performance-optimized and reliable connectivity, this next-generation optical line system ensures a scalable foundation for evolving network demands, empowering growth for the AI era and beyond.”
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Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption
04/15/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.
Nortech Systems Launches Power over Fiber Technology Platform for EMI-Sensitive Applications
04/08/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, has announced the launch of its Power over Fiber technology platform.
PIC & Mix: How Quantum Technologies are Shaking up the Photonic Integrated Circuit Market
04/08/2026 | IDTechExPhotonic integrated circuits (PICs) are optical systems fabricated on semiconductor wafers, allowing complex optical processes to be performed on a chip-scale device.
Boston Micro Fabrication Introduces BMF Clear, Enabling Scalable Optical Microfabrication
04/07/2026 | Boston Micro FabricationBoston Micro Fabrication (BMF), the global leader in micro-precision 3D printing, announces the launch of the BMF Clear, an optically transparent photopolymer resin engineered for applications requiring exceptional light transmission and micron-level accuracy, such as microfluidics, photonics, advanced optical components, biomedical devices and more.
Zhen Ding Releases March 2026 Monthly Revenue Report
04/07/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported March 2026 revenue of NT$15,443 million, up 31.76% MoM and up 7.18% YoY, reaching a record high for the same period in the company’s history.