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Rapidus, Cadence Partner on Agentic AI for Advanced SoC Design

07/20/2026 | Cadence Design Systems
Rapidus Corporation and Cadence announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence® InnoStack™ AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads).

SK Telecom, NVIDIA Build AI Infrastructure to Power Korea’s AI Innovation

06/11/2026 | NVIDIA Newsroom
NVIDIA and SK Telecom announced that SK Telecom plans to build a gigawatt-scale AI Cloud in Korea using the NVIDIA DSX™ platform, with the first AI factory coming online in 2027.

Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA

06/01/2026 | Cadence Design Systems
At Computex 2026, Cadence announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy.

Agentic AI Fuels Memory Demand Growth, Market Projected to Hit $1.28T by 2027

05/29/2026 | TrendForce
The shift in AI development from large-scale model training toward inference-centric Agentic AI applications is driving a structural expansion in memory demand, according to TrendForce's latest findings on the memory industry.

Compal, GMI Cloud Announce Collaboration on AI Infrastructure Development

05/28/2026 | PRNewswire
Compal Electronics Inc. announced its collaboration with GMI Cloud, a Silicon Valley-based AI infrastructure provider, to advance the deployment of next-generation AI infrastructure optimized for large-scale inference and emerging agentic AI workloads.
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