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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.

Wistron Showcases at 2026 OCP Global Summit

10/13/2026 | Wistron
Wistron Corporation and Wiwynn Corporation are participating in the 2026 OCP Global Summit in San Jose, California, under the theme “Create AI Beyond Limits,” showcasing a range of AI solutions and technology applications. ​​​​

North American Demand to Drive Enterprise SSD Price Gains in 4Q26

09/21/2026 | TrendForce
U.S. CSPs have recently upgraded their enterprise SSD demand forecasts over the past two weeks, according to TrendForce’s research.

Synopsys Showcases Autonomous Engineering with NVIDIA

07/28/2026 | PRNewswire
At the 2026 DAC Chips to Systems Conference, Synopsys, Inc. announced advancements to agentic AI for engineering in collaboration with NVIDIA.

Siemens Advances Self-verifying Agentic AI Workflows for Semiconductor and PCB Design

07/27/2026 | Siemens Digital Industries
Siemens announced an expansion of its strategic partnership with NVIDIA to deliver self-verifying agentic AI workflows to EDA, helping semiconductor and printed circuit board (PCB) engineering teams move from autonomous task orchestration toward more trusted, continuously validated engineering outcomes.
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