-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Global Market for Flexible Manufacturing Systems Set to Surge to $22.2 Billion by 2030
March 2, 2026 | GlobeNewswireEstimated reading time: 1 minute
According to the latest study from BCC Research, “Global Market for Flexible Manufacturing Systems” is expected to increase from $15.2 billion in 2025 to $22.2 billion by the end of 2030, at a compound annual growth rate (CAGR) of 7.9% from 2025 through 2030.
The report provides an in-depth analysis of the global market for flexible manufacturing systems, covering the regions of North America, Europe, Asia-Pacific, and the Rest of the World, which includes South America, the Middle East, and Africa. It segments the market by region, level of flexibility, component, and industry, using 2024 as the base year and offering forecasts for 2025-2030. This segmentation helps identify growth opportunities and regional trends shaping the market.
Additionally, the report explores the drivers, challenges, and emerging technologies influencing the market. It examines the vendor landscape, relevant patents, and ESG initiatives undertaken by leading companies, highlighting sustainability and governance practices. Company profiles of major players provide insights into competitive strategies, making this report a valuable resource for understanding market dynamics and future developments.
The factors driving the market include:
Demand for Customized Products in Manufacturing: Consumers increasingly want personalized products, which requires manufacturers to adapt quickly to changing designs and specifications. Flexible manufacturing systems (FMS) enable rapid adjustments without major cost or time increases, making customization feasible at scale.
Advances in Manufacturing Technology: Technologies like automation, robotics, IoT, and AI have enhanced production capabilities. These innovations make FMS more efficient, precise, and cost-effective, encouraging industries to adopt flexible systems for complex and varied tasks.
Need for More Production Efficiency and Reduced Lead Times: Global competition demands faster delivery and lower costs. FMS improves efficiency through quick changeovers, minimal downtime, and optimized resource use, significantly reducing lead times and boosting productivity.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.