SPG Opens New Austin Facility to Expand Engineered Packaging Capabilities and Regional Support
March 4, 2026 | BUSINESS WIREEstimated reading time: 1 minute
Specialized Packaging Group (SPG), a leading provider of sustainable protective packaging solutions, announced the opening of a new Austin-area manufacturing facility. The new 75,000-square-foot site expands the company’s custom-engineered packaging capabilities and strengthens service for customers across the southern and mid-south regions of the U.S.
Located in northeast Austin, the facility strengthens the company’s ability to deliver innovative packaging solutions across a wide range of industries, with initial production focused on engineered corrugated and foam packaging for automotive and technology customers, including the server rack and semiconductor markets.
“The Austin facility represents a strategic milestone for SPG,” said Joe Gumbis, Chief Commercial Officer, SPG. “This site allows us to better support some of our largest customers, respond faster to regional demand and it reinforces our commitment to being in proximity to our customers.”
The facility is equipped with advanced manufacturing technology, including a state-of-the-art rotary die cutter and dual-color printing system, as well as SPG’s first cold-glue automated system for corrugated applications. These capabilities enable the production of highly customized packaging solutions tailored to customers’ specific performance and protection requirements.
As part of its commitment to regional engagement and responsible operations, the Austin facility is creating new jobs in the community and is prioritizing partnerships with local vendors and service providers.
“Establishing this site has been a true team effort,” Gumbis said. “From sourcing local partners to building our workforce, we’re proud to be contributing to the Austin community while delivering the level of quality and service our customers expect.”
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem
05/06/2026 | SEMIGlobal experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.
AI Interconnect Boom Drives Southeast Asia Outsourcing Expansion
05/05/2026 | TrendForceGlobal shipment volume of optical transceivers is projected to more than triple from 26.5 million units in 2023 to over 92 million units by 2026, according to TrendForce’s latest AI infrastructure research.
U.S. Semiconductor Industry Convenes at Glass4Chips Summit
05/04/2026 | NY CREATESThe 2026 Glass4Chips Summit will bring together leaders and innovators across industry, academia, and government to address a framework for accelerating the adoption of glass substrates in next-generation semiconductor manufacturing and packaging.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
AI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity
04/30/2026 | TrendForceTrendForce’s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging.