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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
March 10, 2026 | I-Connect007Estimated reading time: 1 minute
I-Connect007, the leading media source for the electronics manufacturing industry, proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection.
As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.
This comprehensive guide explores smarter access strategies for today’s high-density designs, including boundary scan, built-in self-test (BIST), flying probe, in-circuit test (ICT), and functional testing. Central to the book is the PCOLA-SOQ framework, a structured, measurable method for evaluating inspection and test coverage at both the component and pin levels.
Horner emphasizes that successful DFT implementation requires technical adjustments and a cultural shift. By making test strategy a shared responsibility across engineering, manufacturing, quality, and leadership, organizations can move from reactive troubleshooting to proactive quality assurance.
“Organized like a practical textbook, this book addresses one of the most persistent challenges in electronics manufacturing—ensuring testability without sacrificing innovation,” said Nolan Johnson, SMT007 managing editor. “Bert Horner provides a clear, actionable framework that enables organizations to embed test strategy early, measure it effectively, and align teams around quality from the start.”
Part of I-Connect007’s trusted Printed Circuit Assembler’s Guide to… series, this latest installment reinforces the company’s commitment to delivering practical, expert-driven resources for today’s electronics professionals.
The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection is available exclusively through I-Connect007’s Educational Resource Center. Download the book today by visiting iconnect007.com/dft.
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Julia McCaffrey - NCAB GroupSuggested Items
JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work
04/28/2026 | JAVAD EMSJAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
TRI Launches New Wafer Inspection and Metrology Platform
04/28/2026 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | TomachieTomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.