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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Cicor Divests Tunisia Facility, Launches Program Targeting EBITDA Improvement

06/16/2026 | Cicor
Cicor Group expects recurring annual EBITDA improvements of more than CHF 10 million from a profitability improvement programme supporting the integration of its 2025 acquisitions.

SCHMID Group Records More than €26 Million Order Intake since Mid-May

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SCHMID Group announces a strong combined order intake of more than €26 million since mid-May 2026, reflecting multiple customer orders and continued market momentum in advanced PCB and substrate manufacturing technologies for AI infrastructure and next-generation optical module supply chains.

AT&S Expands Kulim Site to Meet Customer Demand, Strengthen Tech Partnerships

06/15/2026 | AT&S
AT&S announced the expansion of its Kulim manufacturing site, based on agreements with its customer AMD and another leading technology company.

Technica USA Joins Supply Partner Agfa at TechBlick 2026

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Technica USA and Agfa showcased Orgacon® and Agfa’s portfolio of conductive materials at the 2026 TechBlick Conference & Exhibition, held this week at the Computer History Museum in Mountain View, California.

ICAPE Welcomes New Institutional Investor After 1.85% Stake Sale by Thierry Ballenghien

06/11/2026 | ICAPE Group
ICAPE Group announces that the Farringdon European Opportunities fund has acquired a stake in its capital.
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