KOKI Showcases BIG Low-Ag and ICT-ready Solutions at APEX EXPO 2026

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KOKI Solder America, a global leader in advanced soldering materials, announces that it will be exhibiting at APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California. Attendees can visit KOKI at Booth 1323 to explore high-performance soldering solutions engineered for cost stability, reliability, and modern test environments.

BIG Series; Low-Ag. High Confidence

At APEX EXPO 2026, KOKI will spotlight its BIG Low-Ag Alloy Series, a high-reliability, cost-saving lead-free solder paste platform designed as a strategic alternative to SAC305.

With ongoing silver price volatility impacting manufacturing costs, the BIG Series provides a smart path forward:

• 40–60% cost reduction versus SAC305
• Fully compatible with standard SAC305 reflow profiles
• Strong wetting performance and controlled voiding
• Reliability validated through strain-stress (SS) curves and BGA drop testing

By carefully optimizing additive elements, including bismuth, KOKI engineered the BIG platform to align the liquidus temperature with that of SAC305, allowing manufacturers to maintain existing process parameters while reducing material cost exposure.

The result: reduced cost, maintained process stability, and improved long-term reliability confidence.

S3X58-HF960 – Built to Pass, Not Just Print

Also featured at Booth 1323 is S3X58-HF960, KOKI’s halogen-free solder paste specifically engineered for ICT environments.

While many solder pastes are optimized for print performance alone, S3X58-HF960 was developed with downstream testing in mind. Its formulation leaves almost zero flux residue on top of the solder joint, enabling:

• Cleaner probe contact
• Reduced ICT pin clogging
• Improved test yield
• Greater ICT reliability
• Fewer false failures that slow production

In today’s high-mix, high-reliability manufacturing landscape, test yield directly impacts throughput and profitability. S3X58-HF960 helps protect both.

In addition to its material portfolio, KOKI Solder America will highlight its analytical and technical support capabilities. From solder joint analysis and failure evaluation to process optimization and reliability validation, KOKI’s team works alongside manufacturers to diagnose issues, validate improvements, and support continuous process control.

Whether a long-standing customer or a manufacturer simply facing a challenging soldering issue, KOKI positions itself as an extension of the engineering team, providing data-driven insight, metallurgical expertise, and practical solutions that translate to measurable production improvements.