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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Scanfil Suzhou Expansion Project Breaks Ground

06/16/2026 | Scanfil
Scanfil marked an important milestone in its growth in China with the groundbreaking of its expansion project at the Suzhou plant on June 8.

Technica USA and Supply Partners Participate in SMTA San Diego Expo and Tech Forum

06/15/2026 | Technica USA
Technica USA, along with its valued partners, Inovaxe and Creative Electron, participated in the SMTA San Diego Expo & Tech Forum last week at the El Corazon Event Center.

Fuji Launches the Auto Kitting Station

06/12/2026 | Fuji Corporation
Fuji Corporation has developed a new unit, the Auto Kitting Station, which automates the tape reel loading process (kitting process) for feeders used to supply electronic components to machines; a process that has traditionally been difficult to automate and heavily dependent on manual labor.

Flex to Join S&P 500 Index

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Flex announced it has been selected to join the S&P 500 Index, effective prior to the open of trading on Monday, June 22, 2026.

MacDermid Alpha Showcases Advanced Soldering Materials for High-Reliability Electronics Assembly at NEPCON Thailand 2026

06/11/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will present its latest materials technologies at NEPCON Thailand 2026, held June 17 to 20 at the Bangkok International Trade & Exhibition Centre (BITEC), Thailand. Recognized as a premier gathering for technology leaders and manufacturers, the event supports one of the world’s most dynamic electronics manufacturing regions.
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