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AdvancedPCB announced the promotion of John Stine to Chief Technology Officer (CTO). A widely respected figure in the PCB industry, Stine has nearly four decades of experience spanning design, materials, manufacturing, engineering, quality, sales, and assembly.
Stine most recently served as Executive Vice President of Aerospace & Defense Strategic Business Development. Since joining AdvancedPCB, he has played a key role in advancing the company’s technical capabilities and supporting customers in some of the industry’s most demanding sectors. Prior to hat role, Stine served as Vice President of Operations at APCT, where he helped guide operational strategy and performance.
In his new role as CTO, Stine will lead AdvancedPCB’s technology strategy and guide the company’s continued investment in advanced manufacturing capabilities. He will work closely with engineering and operations teams to strengthen technical infrastructure, expand capabilities, and support the company’s rapid growth across aerospace, defense, AI/data centers, medical, and other high-reliability markets.
“John’s journey with us has been nothing short of remarkable,” said Greg Halvorson, CEO of AdvancedPCB. “Over the years, he has demonstrated exceptional leadership, technical expertise, and a relentless commitment to driving innovation. His contributions have been instrumental in advancing our products and shaping the direction of our technology.”
“I’m honored to take on the role of Chief Technology Officer at a time when our customers are facing increasing technical complexity and faster development cycles," said John Stine, Chief Technology Officer for AdvancedPCB. "My focus is on strengthening the technical partnership with our customers so we can solve harder problems, accelerate development cycles, and deliver reliable PCB solutions for their most demanding applications.”
Stine is Lean Six Sigma certified and is recognized throughout the electronics manufacturing community for his extensive hands-on experience and practical approach to solving complex technical challenges.
