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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Boyd Completes the Sale of its Thermal Business to Eaton for $9.5 Billion
March 13, 2026 | BUSINESS WIREEstimated reading time: 1 minute
Boyd Corporation, the trusted global innovator in engineered materials and thermal solutions, announced it has completed the sale of its Thermal business to Eaton, an intelligent power management company, for $9.5 billion as previously announced on November 3rd, 2025.
Boyd’s Engineered Materials business will now operate as an independent company backed by Goldman Sachs Alternatives. Boyd’s Engineered Materials business will continue to design and manufacture advanced technologies that seal, shield, insulate, and protect while enhancing the efficiency, reliability, and lifecycle of its customers’ products across secular growth markets.
Boyd is strategically positioned to continue to drive transformative growth through extensive material science expertise, advanced engineering, differentiated manufacturing technologies, and trusted customer partnerships.
“Boyd has captured high growth opportunities by delivering innovative, customer-centric solutions to critical, rapidly expanding markets like medical wearables, AI data centers, battery energy storage, low earth orbital satellites, and emerging markets such as robotics,” said Doug Britt, Chief Executive Officer of Boyd. “With the sale of our Thermal business, our leadership team is excited to transition their focus to the successful growth of our global Engineered Materials business.”
“Boyd exemplifies Goldman Sachs Alternatives’ commitment to backing strong businesses with excellent management teams in sectors with resilient long-term fundamentals,” said Leonard Seevers, Partner in Private Equity at Goldman Sachs Alternatives. “We are proud of the accomplishments of the entire team at Boyd’s Thermal business, and we are excited to continue supporting Boyd Corporation on its continued growth.”
This divestiture has no impact on Boyd’s Engineered Materials’ operations since historically, Boyd maintained segmented operations, leadership, R&D, sales and customer support teams between the Thermal and Engineered Materials businesses. Boyd’s Engineered Materials customers will continue to receive the same high-quality service they expect from Boyd.
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Sweeney Ng - CEE PCBSuggested Items
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial TeamI-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Podcast Hits the Mark in a Materials Market
04/15/2026 | Marcy LaRont, I-Connect007The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.