American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
Defense Speak Interpreted: Hypersonics Report Back After Six Years of Silence
IPC Committee Launches Development of New Standard: IPC-7712 Component Safe Removal for Failure Analysis and Reclamation
March 18, 2026 | Circuit Technology Center, Inc.Estimated reading time: 2 minutes
Industry experts from across the electronics manufacturing sector will meet this week to continue formal development work on a new IPC standard titled IPC‑7712 Component Safe Removal for Failure Analysis and Reclamation. The effort brings together leading engineers, reliability specialists, and failure analysis professionals to establish best practices for the safe removal of electronic components intended for analysis, reclamation, and potential reuse.
The committee responsible for the standard is chaired by Jeff Ferry, President at Circuit Technology Center, an industry leader in circuit board repair and rework technologies. The working group will operate under the guidance of IPC liaison Francisco Fourcade, who will coordinate the development of the standard and ensure alignment with IPC's consensus-driven standards framework.
The new standard addresses a growing industry need as electronics manufacturers, failure analysis laboratories, and sustainability initiatives increasingly focus on safe component extraction techniques. Proper removal methods are critical when preserving high-value devices for root-cause investigation, reliability testing, or reclamation.
"Electronic components are becoming more valuable and complex, particularly with the rise of advanced microprocessors, AI chips, and high-density packaging," said Ferry. "The industry needs clear guidance on how to remove components without damaging them or the surrounding assembly. IPC-7712 will establish standardized methods that support both failure analysis and responsible component reclamation."
The initiative reflects broader industry priorities around electronics sustainability, supply chain resilience, and reliability engineering. Salvaging usable components and preserving devices for analysis can reduce material waste, improve investigative accuracy, and extend the lifecycle of valuable semiconductor devices.
Once completed, IPC-7712 will provide standardized guidance covering topics such as:
- Controlled thermal and mechanical removal techniques
- Protection of component leads, pads, and package integrity
- Handling and marking of reclaimed components
- Documentation and traceability practices
- Methods to support failure analysis without inducing additional damage
The committee's work will proceed through IPC's consensus standards process, incorporating input from OEMs, contract manufacturers, repair specialists, failure analysis laboratories, and semiconductor industry representatives.
IPC standards serve as globally recognized guidelines for electronics manufacturing, assembly, and repair. The development of IPC-7712 aims to fill an important gap by defining safe removal practices specifically intended to preserve component integrity for analysis and reclamation.
Additional information on the standard's progress will be released as the committee advances through the drafting and review phases.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/01/2026 | Michelle Te, I-Connect007If it feels like the PCB industry is accelerating faster than ever, you’re not imagining it. From advanced materials driven by AI applications to renewed investment in domestic manufacturing—and the next generation stepping into critical roles—there’s a lot shifting at once. My selections for this week highlight where the pressure points are forming, and where the opportunities are emerging.