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Advanced Electronics Packaging Digest

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AT&S Celebrates 50 Years of Fehring with Leaders from Politics and Industry

07/06/2026 | AT&S
At its long-established site in Fehring, southeastern Styria, where serial production of PCBs began in 1976, AT&S looked back on five decades of successful development.

50 Years in Fehring: AT&S Invests Millions in Future of Site in Austria

07/03/2026 | AT&S
AT&S is celebrating the 50th anniversary of PCB volume production at its Austrian site in Fehring and sending a strong signal for the future: With another multi-million euro investment, the company is strengthening its expertise in the PCB business and opening up new growth opportunities in strategically important future markets.

Teledyne MEMS Selected to Support Two FABrIC Challenge Award Recipients

06/29/2026 | BUSINESS WIRE
Teledyne MEMS announced that it has been selected as the advanced micro-electro-mechanical systems (MEMS) manufacturing partner for two recipients of the latest FABrIC Challenge funding awards announced by CMC Microsystems through the Government of Canada’s FABrIC initiative.

Nokia Announces Major Expansion of U.S. Semiconductor Advanced Test and Packaging in Pennsylvania to Bolster AI Growth

06/24/2026 | Nokia
Nokia announced a major expansion of its advanced test and packaging (ATP) operations in Allentown, Pennsylvania. The investment will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity across the United States.

Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions

06/23/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company.
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