Qnity Collaborates with NVIDIA to Accelerate Innovation for Semiconductor and Advanced Electronics Materials
March 19, 2026 | QnityEstimated reading time: 1 minute
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced a collaboration with NVIDIA to accelerate AI‑driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration is focused on advancing materials research and development to support next‑generation AI, high‑performance computing, and advanced packaging technologies. Maintaining signal integrity at higher speeds and densities is critical to system performance and reliability.
“As AI workloads continue to grow in scale and complexity, the demand for advanced materials that deliver higher performance, quality, and reliability is increasing across the industry,” said Jon Kemp, Chief Executive Officer, Qnity. “The next wave of progress will depend on bold innovation and close collaboration across the ecosystem.”
The initiative reflects Qnity’s continued focus on advancing materials innovation across the semiconductor ecosystem, from chip manufacturing and advanced packaging to high‑speed interconnects and system‑level integration, while helping customers address the evolving demands of AI‑driven workloads.
“Open innovation means staying ahead of the curve, anticipating industry’s needs before they become requirements, and our job in R&D is to see around corners,” said Randy King, Chief Technology and Sustainability Officer, Qnity. “Leveraging accelerated modeling allows us to compress development timelines and bring innovation for cutting-edge applications to market faster, while optimizing performance factors such as signal integrity, reliability, and manufacturability. For decades, our customers have counted on us for quality innovation that scales quickly to meet their needs.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Foxconn Recognized as Top 100 Global Innovators 2026
04/14/2026 | FoxconnHon Hai Technology Group (Foxconn) has been named in Clarivate’s Top 100 Global Innovators 2026, a milestone for the ninth year running and as the accelerating role of artificial intelligence stood out in innovation activity among peers in the prestigious ranking.
Marcy’s Musings: Operating Without a Rulebook
04/15/2026 | Marcy LaRont -- Column: Marcy's MusingsWhat happens when the rulebook is no longer useful, or worse, has not yet been written? With electronics innovation happening at warp speed, we’re increasingly asked to design and build what has no precedent, proven path, or tidy checklist to follow. “Design for invention” begins at the edge of known capability, where traditional DFM gives way to something far less certain, and far more exciting. It’s not about breaking rules for the sake of it; it’s about recognizing when the rules no longer apply and having the insight, collaboration, and courage to move forward anyway.
Keysight, Sateliot Win European Space Agency and GSMA Foundry Challenge for 6G Innovation
04/08/2026 | Keysight Technologies, Inc.Keysight Technologies, Inc., together with Sateliot, has been named a winner of the fifth annual European Space Agency (ESA) and GSMA Foundry Innovation Challenge for its joint project, “Blockchain-enabled anomaly detection end‑to‑end solution for 5G Non‑Terrestrial Networks.”
Wire Harness Taking a Step in the Right Direction
04/08/2026 | Nolan Johnson, SMT007 MagazineTo fully understand the modernization of wire harness design and assembly, we met with members of the Innovation Advisory Team for the Wire Harness Manufacturer’s Association (WHMA) to outline the current challenges facing wire harnesses and the specific steps to implement a digital data flow from OEM to manufacturer and back. In some ways, the wire harness industry is moving from 19th-century to 21st-century technology. But in the meantime, the real challenge isn’t building the harness—manufacturers are very good at that.
IISc, CADFEM & Synopsys Launch Advanced Simulation Center at CeNSE
03/26/2026 | PRNewswireUltra-high-speed electronic systems are increasingly shaping the technological frontier across sectors such as aerospace and defence, advanced healthcare, robotics, autonomous mobility, and high-performance computing.