I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Estimated reading time: 4 minutes

It’s been a busy week for many of us traversing the conference halls and exhibition floor at APEX EXPO in Anaheim, California. This is the 26th event since it was renamed APEX EXPO in 2000. For those who love trivia, and in reverence to the founders, a more accurate accounting is that 2026 marks its 33rd year, beginning in 1994 as the IPC Printed Circuits Expo. It’s always a great time to convene with old friends, colleagues, and customers, as well as to meet exciting new companies and individuals with interesting things to share. And afterwards, it’s always nice to get home.

Be sure to check out the third installment of On the Line With ... Isola podcast. You will gain a deeper understanding of how sustainability initiatives are influencing PCB material development and what design and manufacturing teams should consider as they work toward greener electronics.

My highlights this week include an announcement about IPC-7712, which addresses the need for safe removal, inspection, and re-use of expensive components, guidance that is greatly needed. Tom Kastner’s “Punching Out” column counts the number of PCB shops in North America. I-Connect007 Magazine was published this week, so please read my column for a detailed glimpse inside this “potpourri” issue. I’m featuring an interview with NCAB’s resident technical expert Jan Pedersen, and you'll want to read this great conversation introducing Kevin O’Hanlon, a dynamic new voice in U.S. advocacy for the PCB industry on Capitol Hill.

Happy Friday and have a great weekend!

IPC Committee Launches Development of New Standard: IPC-7712 Component Safe Removal for Failure Analysis and Reclamation
Published March 18

Much work was done on a new and much-needed standard, IPC-7712, Component Safe Removal for Failure Analysis and Reclamation. "Electronic components are becoming more valuable and complex, particularly with the rise of advanced microprocessors, AI chips, and high-density packaging," said Jeff Ferry, committee chair. "The industry needs clear guidance on how to remove components without damaging them or the surrounding assembly. IPC-7712 will establish standardized methods that support both failure analysis and responsible component reclamation. I, along with many others, are glad to see this standard well under development.

Punching Out: How Many PCB Companies Are There in North America Now?
Published March 19

Tom Kastner’s recent “Punching Out” column asks just how many PCB companies are there in North America now? I won’t ruin the punchline, but in just two years, from 2020 to 2022, we’ve seen the number drop by 30, whether through an acquisition into a larger entity or a closing. That is not a small number. “The decline in the number of shops should be alarming to those responsible for security, as PCBs are a critical component of many strategic products.”

Marcy’s Musings: Our Own March Madness
Published March 18

The March issue of I-Connect007 Magazine was published this week, and I hope you’ll rad my column that provides more details about this big “potpourri” issue. In our design content, we focus on copper pours, and in fab, we cover a broader range of topics, including managing cumulative tolerances and expanded APEX EXPO coverage. To get a more detailed glimpse, read on.

Kevin O’Hanlon: A New Voice for Electronics on Capitol Hill
Published March 18

I enjoyed my conversation with Kevin O’Hanlon, the Global Electronics Association’s new vice president of North American government relations, who works on Capitol Hill. Kevin may be new to our industry specifically, but he is not new to Washington, D.C., or to electronics, having been involved in CHIPS Act discussions early on, though his experience is broad across several industries. He’s engaging, intelligent, and thoughtful in his responses. Kevin seems to truly understand where we are in the U.S. and what we need now and in the future. Welcome to a team that is working to secure a solid future for U.S. PCB manufacturing, Kevin. We are glad you are here.

IC Substrates vs. UHDI: The Future of Interconnect
Published March 15

If you don’t know Jan Pedersen, you probably should. Interesting to talk to and full of great information, we had a conversation after his presentation at January’s Pan-European Design Conference, where he took me through a journey of PCB technology and where we find ourselves today when it comes to interconnect and the future of PCBs and its near relatives. We start the interview by recounting his words to PEDC attendees, and that is what I will leave you with here: “We are all on a journey. If you think you have reached your optimum, your target, then you are close to retirement or on your way to closure.” This is a great read.