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Advanced Electronics Packaging Digest

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LG Innotek Partners with TDK to Develop Solutions for Physical AI

07/28/2026 | PRNewswire
LG Innotek announced that the company has aligned on a strategic partnership in the field of physical AI with TDK Corporation, a global electronics company (President and CEO Noboru Saito).

SMP Forms Joint Venture with Techstrong to Expand Sensor Manufacturing Capabilities

07/06/2026 | PRNewswire
Standard Motor Products, Inc. announced it has entered into a 50/50 joint venture agreement with Techstrong Holdings Limited to form Techstrong Electronics (Thailand) Company Limited, an automotive sensor manufacturing company.

Teledyne's Emerald 67M Space Camera Enabled by SDL License

07/06/2026 | BUSINESS WIRE
Teledyne Digital Imaging US, Inc., a Teledyne Technologies company, announced a new high-resolution space-ready camera based on its Emerald™ 67M CMOS image sensor.

Infineon Completes Acquisition of ams OSRAM Sensor Portfolio

07/01/2026 | Infineon
Infineon Technologies AG completed the acquisition of the non-optical analog/mixed-signal sensor portfolio from ams OSRAM Group.

Ouster, Benchmark Expand Partnership to Scale REV8 Lidar Production

06/18/2026 | Benchmark
Ouster, Inc., a leader in sensing and perception for Physical AI, and Benchmark Electronics, Inc., a global provider of manufacturing, engineering, and technology services, announced the expansion of their long-term manufacturing partnership to support the high-volume production of Ouster's new Rev8 OS sensor family for industrial, robotics, automotive, and smart infrastructure applications.
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